[VLP] Boemo bo tlase haholo ED Copper Foil
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Kenyelletso ea Sehlahisoa
VLP, foil ea koporo e tlase haholo ea electrolytic e hlahisoang ke CIVEN METAL e na le litšobotsi tsa bokhopo bo tlase le matla a lekhapetla le phahameng. Foil ea koporo e hlahisoang ke ts'ebetso ea electrolysis e na le melemo ea bohloeki bo phahameng, litšila tse tlase, bokaholimo bo boreleli, sebopeho sa boto e bataletseng, le bophara bo boholo. The electrolytic koporo foil ka betere laminated le lisebelisoa tse ling ka mor'a ho roughening ka lehlakoreng le leng, 'me ha ho bonolo ho ebola.
Litlhaloso
CIVEN e ka fana ka ultra-tlase boemo bo phahameng ba mocheso ductile electrolytic koporo foil (VLP) ho tloha 1/4oz ho 3oz (ka lebitso botenya 9µm ho 105µm), 'me boholo ba sehlahisoa sa boholo ke 1295mm x 1295mm lakane foil koporo.
Tshebetso
CIVEN e fana ka foil ea koporo e teteaneng ea electrolytic e nang le thepa e ntle ea 'mele ea equiaxial fine crystal, boemo bo tlase, matla a phahameng le bolelele bo phahameng. (Sheba Letlapa la 1)
Lisebelisoa
E sebetsa ho etsoa ha liboto tsa potoloho tse matla le liboto tsa maqhubu a phahameng bakeng sa likoloi, matla a motlakase, puisano, sesole le sefofane.
Litšobotsi
Ha ho bapisoa le lihlahisoa tse tšoanang tsa kantle ho naha.
1.Sebopeho sa lijo-thollo tsa VLP ea rona ea electrolytic koporo foil e equiaxed fine crystal spherical; ha sebopeho sa lijo-thollo tsa lihlahisoa tse tšoanang tsa kantle ho naha e le kholomo ebile e telele.
2. Electrolytic koporo foil ke ultra-tlase profile, 3oz koporo foil gross surface Rz ≤ 3.5µm; ha lihlahisoa tse ts'oanang tsa kantle ho naha e le profil e tloaelehileng, 3oz copper foil gross surface Rz> 3.5µm.
Melemo
1.Ho tloha ha sehlahisoa sa rona se le boemong bo tlaase haholo, se rarolla kotsi e ka 'nang ea e-ba teng ea potoloho e khutšoanyane ea mohala ka lebaka la boima bo boholo ba foil e teteaneng ea koporo le ho kenella habonolo ha letlapa le tšesaane la ho kenya letsoho ka "leino la phiri" ha u hatella phanele e mahlakore a mabedi.
2.Hobane sebopeho sa lijo-thollo tsa lihlahisoa tsa rona e equiaxed e ntle kristale spherical, e khutsufatsa nako ea line etching le ho ntlafatsa bothata ba ho sa leka-lekaneng lehlakoreng etching.
3, ha e ntse e e-na le matla a phahameng a peel, ha ho phetiso ea phofo ea koporo, ts'ebetso ea tlhahiso ea PCB e hlakileng.
Tshebetso(GB/T5230-2000、IPC-4562-2000)
| Karolelano | Yuniti | 9mm | 12μm | 18μm | 35μm | 70μm | 105μm | |
| Cu Content | % | ≥99.8 | ||||||
| Boima ba Sebaka | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | 585±10 | 875±15 | |
| Matla a tšepe | RT(23℃) | Kg/mm2 | ≥28 | |||||
| HT(180℃) | ≥15 | ≥18 | ≥20 | |||||
| Elongation | RT(23℃) | % | ≥5.0 | ≥6.0 | ≥10 | |||
| HT(180℃) | ≥6.0 | ≥8.0 | ||||||
| Boqhobane | E benyang(Ra) | μm | ≤0.43 | |||||
| Matte(Rz) | ≤3.5 | |||||||
| Matla a Peel | RT(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.5 | ≥2.0 |
| Sekhahla se theohileng sa HCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||||
| Ho fetoha ha 'mala(E-1.0hr/200℃) | % | E ntle | ||||||
| Solder e Phaphameng 290 ℃ | Karolo. | ≥20 | ||||||
| Ponahalo(Letheba le phofo ea koporo) | ---- | Ha ho letho | ||||||
| Pinhole | EA | Zero | ||||||
| Mamello ea Boholo | Bophara | mm | 0 ~ 2 limilimithara | |||||
| Bolelele | mm | ---- | ||||||
| Ea mantlha | Mm/inch | Ka hare Diameter 79mm/3 inch | ||||||
Hlokomela:1. Theko ea Rz ea foil ea koporo ke boleng bo tsitsitseng ba teko, eseng boleng bo tiisitsoeng.
2. Matla a Peel ke boleng bo tloaelehileng ba tlhahlobo ea boto ea FR-4 (maqephe a 5 a 7628PP).
3. Nako ea netefatso ea boleng ke matsatsi a 90 ho tloha ka letsatsi la ho amoheloa.
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