[HTE] Elongation e Phahameng ED Copper Foil
![[HTE] High Elongation ED Copper Foil Featured Image](http://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil.png)
Kenyelletso ea Sehlahisoa
HTE, mocheso o phahameng le bolelele foil ea koporo e hlahisoang keCIVEN TŠEPEe na le khanyetso e babatsehang ho mocheso o phahameng le ductility e phahameng.Foil ea koporo ha e oxidize kapa e fetola 'mala ka mocheso o phahameng,' me ductility ea eona e ntle e etsa hore ho be bonolo ho laminate ka lisebelisoa tse ling.Foil ea koporo e hlahisoang ke ts'ebetso ea electrolysis e na le sebaka se hloekileng haholo le sebopeho sa sheet sheet.The foil koporo ka boeona e roughened ka lehlakoreng le leng, e leng ho etsa hore ho be bonolo ho khomarela lisebelisoa tse ling.Bohloeki ka kakaretso ba foil ea koporo bo phahame haholo, 'me e na le motlakase o motle haholo oa motlakase le oa mocheso.E le hore re finyelle litlhoko tsa bareki ba rona, re ka fana ka meqolo feela ea foil ea koporo, empa hape le litšebeletso tse entsoeng ka mokhoa o ikhethileng.
Litlhaloso
Botenya: 1/4OZ～20OZ(9µm～70µm)
Bophara: 550mm～1295 limilimithara
Tshebetso
Sehlahisoa se na le ts'ebetso e ntle ea polokelo ea mocheso oa kamore, ts'ebetso e phahameng ea mocheso oa oxidation, boleng ba sehlahisoa ho fihlela maemo a IPC-4562.Ⅱ, Ⅲditlhoko tsa boemo.
Lisebelisoa
E loketse mefuta eohle ea sistimi ea resin ea boto ea potoloho e nang le mahlakore a mabeli, e hatisitsoeng ka bongata
Melemo
Sehlahisoa se nka mokhoa o khethehileng oa phekolo ea holim'a metsi ho ntlafatsa bokhoni ba sehlahisoa sa ho hanyetsa ho bola ha tlase le ho fokotsa kotsi ea masala a koporo.
Tshebetso(GB/T5230-2000、IPC-4562-2000)
| Karolelano | Yuniti | 1/4OZ (9μm) | 1/3OZ (12μm) | J OZ (15μm) | 1/2OZ (18μm) | 1OZ (35μm) | 2OZ (70μm) | |
| Cu Content | % | ≥99.8 | ||||||
| Boima ba Sebaka | g/m2 | 80±3 | 107±3 | 127±4 | 153±5 | 283±5 | 585±10 | |
| Matla a tšepe | RT(25℃) | Kg/mm2 | ≥28 | ≥30 | ||||
| HT(180℃) | ≥15 | |||||||
| Elongation | RT(25℃) | % | ≥4.0 | ≥5.0 | ≥6.0 | ≥10 | ||
| HT(180℃) | ≥4.0 | ≥5.0 | ≥6.0 | |||||
| Boqhobane | E benyang(Ra) | μm | ≤0.4 | |||||
| Matte(Rz) | ≤5.0 | ≤6.0 | ≤7.0 | ≤7.0 | ≤9.0 | ≤14 | ||
| Matla a Peel | RT(23℃) | Kg/cm | ≥1.0 | ≥1.2 | ≥1.2 | ≥1.3 | ≥1.8 | ≥2.0 |
| Sekhahla se theohileng sa HCΦ(18%-1hr/25℃) | % | ≤5.0 | ||||||
| Ho fetoha ha 'mala(E-1.0hr/190℃) | % | E ntle | ||||||
| Solder e Phaphameng 290 ℃ | Karolo. | ≥20 | ||||||
| Pinhole | EA | Zero | ||||||
| Preperg | ---- | FR-4 | ||||||
Hlokomela:1. Theko ea Rz ea foil ea koporo ke boleng bo tsitsitseng ba teko, eseng boleng bo tiisitsoeng.
2. Matla a Peel ke boleng bo tloaelehileng ba tlhahlobo ea boto ea FR-4 (maqephe a 5 a 7628PP).
3. Nako ea netefatso ea boleng ke matsatsi a 90 ho tloha ka letsatsi la ho amoheloa.
![[BCF] Betri ED Copper Foil](http://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
![[VLP] Boemo bo tlase haholo ED Copper Foil](http://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
![[RTF] Reverse Treated ED Copper Foil](http://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)