ED Copper Foils bakeng sa FPC
Kenyelletso ea Sehlahisoa
FCF, e tenyetsehafoil ea koporo e ntlafalitsoe ka ho khetheha le ho etsetsoa indasteri ea FPC (FCCL).Sefaele sena sa koporo sa electrolytic se na le ductility e betere, mahoashe a tlase le matla a betere ho fetatse ding foil ea koporos.Ka nako e ts'oanang, qetello ea bokaholimo le bokhabane ba foil ea koporo e molemo le ho hanyetsa ho phutha kehapemolemo ho feta lihlahisoa tse tšoanang tsa koporo foil.Kaha foil ena ea koporo e thehiloe ts'ebetsong ea electrolytic, ha e na mafura, e leng se etsang hore ho be bonolo ho kopanngoa le lisebelisoa tsa TPI ka mocheso o phahameng.
Dimension Range:
Botenya:9µm～35µm
Tshebetso
Sebaka sa sehlahisoa se ntšo kapa se khubelu, se na le mahoashe a tlaase.
Lisebelisoa
Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED e koahetsoeng ka filimi e tšesaane ea kristale.
Likaroloana:
Boima bo phahameng, khanyetso e phahameng ea ho kobeha le ts'ebetso e ntle ea etching.
Microstructure:
SEM (Lehlakore le Lebe kamora Kalafo)
SEM (Pele ho Phekolo ea Bokaholimo)
SEM (Lehlakore le Benyang ka mor'a Phekolo)
Table1- Tshebetso (GB/T5230-2000、IPC-4562-2000):
| Karolelano | Yuniti | 9mm | 12μm | 18μm | 35μm | |
| Cu Content | % | ≥99.8 | ||||
| Boima ba Sebaka | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | |
| Matla a tšepe | RT(23℃) | Kg/mm2 | ≥28 | |||
| HT(180℃) | ≥15 | ≥15 | ≥15 | ≥18 | ||
| Elongation | RT(23℃) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 |
| HT(180℃) | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ||
| Boqhobane | E benyang(Ra) | μm | ≤0.43 | |||
| Matte(Rz) | ≤2.5 | |||||
| Matla a Peel | RT(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.8 | ≥0.8 |
| Sekhahla se fokolisitsoeng sa HCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||
| Ho fetoha ha 'mala(E-1.0hr/200℃) | % | E ntle | ||||
| Solder e Phaphameng 290 ℃ | Karolo. | ≥20 | ||||
| Ponahalo(Letheba le phofo ea koporo) | ---- | Ha ho letho | ||||
| Pinhole | EA | Zero | ||||
| Mamello ea Boholo | Bophara | mm | 0 ~ 2 limilimithara | |||
| Bolelele | mm | ---- | ||||
| Ea mantlha | Mm/inch | Ka hare Diameter 79mm/3 inch | ||||
Tlhokomeliso: 1. Ts'ebetso ea koporo ea foil oxidation resistance le index density index li ka buisanoa.
2. Lenane la tšebetso le itšetlehile ka mokhoa oa rona oa teko.
3. Nako ea tiiso ea boleng ke matsatsi a 90 ho tloha letsatsing la ho fumana.
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