Lesela le entsoeng ka thini le entsoeng ka koporo
Kenyelletso ea Sehlahisoa
Lihlahisoa tsa koporo tse pepesehileng moeeng li atisa hooxidationle ho thehoa ha carbonate ea motheo ea koporo, e nang le khanyetso e phahameng, conductivity e fokolang ea motlakase le tahlehelo e phahameng ea phetisetso ea matla;ka mor'a ho roala tin, lihlahisoa tsa koporo li etsa lifilimi tsa tin dioxide moeeng ka lebaka la thepa ea tšepe ka boeona ho thibela oxidation e eketsehileng.
Boitsebiso ba Motheo
●Foil ea Koporo e Fetang ka nepo e phahameng, Cu(JIS: C1100/ASTM: C11000) litaba tse fetang 99.96%
Base Material Thickness Range
●0.035mm~0.15mm (0.0013 ~0.0059inches)
Base Material Width Range
●≤300mm (≤11.8 inch)
Base Material Temper
●Ho ea ka litlhoko tsa bareki
Kopo
●Indasteri ea lisebelisoa tsa motlakase le tsa elektroniki, ea sechaba (joalo ka: ho paka lino le lisebelisoa tsa ho ikopanya le lijo);
Mekhahlelo ea Ts'ebetso
| Lintho | Thepa ea Tin e chesehang | Sekhahla sa Tin se sa cheseheleng |
| Bophara Range | ≤600mm (≤23.62inch) | |
| Botenya Range | 0.012~0.15mm (0.00047inches~0.0059inches) | |
| Tin layer Botenya | ≥0.3µm | ≥0.2µm |
| Likahare tsa Tin tsa Lera la Tin | 65 ~ 92% (E ka fetola litaba tsa thini ho latela ts'ebetso ea tjheseletsa ea bareki) | 100% Tin e Hloekileng |
| Bokaholimo bo hanyetsanang le Lera la Tin(Ω) | 0.3~0.5 | 0.1~0.15 |
| Ho khomarela | 5B | |
| Matla a tšepe | Base Material Attenuation ka mor'a Plating ≤10% | |
| Elongation | Base Material Attenuation After Plating ≤6% | |
