Tin e bapalang foil ea koporo
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Lihlahisoa tsa koporo li pepesitsoe moeeng li tloaetse hooxidationHo theha carpanate ea motheo ea koporo, e nang le boitšoaro bo phahameng haholo, boitšoaro bo bobe ba motlakase ba motlakase le tahlehelo ea phetisetso e phahameng ea motlakase; Kamora hore tiin plating, lihlahisoa tsa koporo tsa koporo li etsa lifilimi tsa li-dioxide moeeng ka lebaka la thepa ea tšepe ho thibela oxidation e tsoelang pele.
Lintho tse iqapetsoeng
●Sepheo sa Copper Foil, Cu (Jis: C1100 / ASTM: C11000) Likahare ho feta 99.96%
Theho ea lintho tse boima
●0.035mm ~ 0.15mm (0.0013 ~ 0,0059inches)
Thepa ea lintho tse bonahalang
●≤300mm (≤11.8 inches)
Thepa ea lintho tse bonahalang
●Ho latela litlhoko tsa bareki
Kopo
●Lisebelisoa tsa motlakase le indasteri ea motlakase, ea elektroniki, sechaba (sechabeng joalo ka: ho paka ka thata le ho ikopanya le lijo);
Litekanyetso tsa ts'ebetso
| Lintho | Ho qala ha tin ho penta | Selali sa se seng |
| Bophara | ≤600mm (≤23.62inches) | |
| Bophara ba botenya | 0.012 ~ 0.15mm (0.00047Inches ~ 0,0059inches) | |
| Tin Lakerness | ≥0.3μm | ≥0.2μm |
| Tin litaba tsa tin | 65 ~ 92% (e ka fetola litaba tsa tin ho latela ts'ebetso ea mekoloto ea bareki) | 100% tin e hloekileng |
| Bokaholimo bo hanyetsanang ha tin(Ω) | 0.3 ~ 0.5 | 0.1 ~ 0,15 |
| Kholiseho | 5B | |
| Matla a tšepe | Theko ea ts'ebetso ea boitsebiso ka mor'a ho beha ≤10% | |
| Emplation | Theko ea boitsebiso ba boitsebiso bo sa reng letho kamora ho beha ≤6% | |
![[VLP]](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
![[HTA] ELL Copper Forep ea Copper Foil](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)