Super Thick ED Copper Foils
Kenyelletso ea Sehlahisoa
The ultra-thick low-profile electrolytic copper foil e hlahisoang ke CIVEN METAL ha e khonehe feela ka mokhoa oa botenya ba koporo ea koporo, empa e boetse e na le boima bo tlaase le matla a ho arohana a phahameng, 'me sebaka se thata ha se bonolo ho oela phofo. Re ka boela ra fana ka tšebeletso ea slicing ho latela litlhoko tsa bareki.
Litlhaloso
CIVEN e ka fana ka foil ea koporo e teteaneng haholo, ea boemo bo tlase, ea mocheso o phahameng oa ultra-thick electrolytic copper foil (VLP-HTE-HF) ho tloha ho 3oz ho isa ho 12oz (botenya ba lebitso 105µm ho isa ho 420µm), mme boholo ba sehlahisoa sa boholo ke 1295mm x 129mm sheet. foil ea koporo.
Tshebetso
CIVEN e fana ka foil ea koporo e teteaneng ea electrolytic e nang le thepa e ntle ea 'mele ea equiaxial fine crystal, boemo bo tlase, matla a phahameng le bolelele bo phahameng. (Sheba Letlapa la 1)
Lisebelisoa
E sebetsa ho etsoa ha liboto tsa potoloho tse matla le liboto tsa maqhubu a phahameng bakeng sa likoloi, matla a motlakase, puisano, sesole le sefofane.
Litšobotsi
Ha ho bapisoa le lihlahisoa tse tšoanang tsa kantle ho naha.
1.Sebopeho sa lijo-thollo tsa mofuta oa rona oa VLP foil ea koporo e teteaneng ea electrolytic e equiaxed fine crystal spherical; ha sebopeho sa lijo-thollo tsa lihlahisoa tse tšoanang tsa kantle ho naha e le kholomo ebile e telele.
2. CIVEN ultra-thick electrolytic koporo foil ke ultra-tlase profile, 3oz koporo foil gross surface Rz ≤ 3.5µm; ha lihlahisoa tse ts'oanang tsa kantle ho naha e le profil e tloaelehileng, 3oz copper foil gross surface Rz> 3.5µm.
Melemo
1.Ho tloha ha sehlahisoa sa rona se le boemong bo tlaase haholo, se rarolla kotsi e ka 'nang ea e-ba teng ea potoloho e khutšoanyane ea mohala ka lebaka la boima bo boholo ba foil e teteaneng ea koporo le ho kenella habonolo ha letlapa le tšesaane la PP ka "leino la phiri" ha u hatella. phanele e mahlakore a mabedi.
2.Hobane sebopeho sa lijo-thollo tsa lihlahisoa tsa rona e equiaxed e ntle kristale spherical, e khutsufatsa nako ea line etching le ho ntlafatsa bothata ba ho sa leka-lekaneng lehlakoreng etching.
3.Ha u ntse u e-na le matla a phahameng a peel, ha ho phetiso ea phofo ea koporo, litšoantšo tse hlakileng tsa ts'ebetso ea tlhahiso ea PCB.
Lethathamo la 1: Tshebetso(GB/T5230-2000、IPC-4562-2000)
| Karolelano | Yuniti | 3oz | 4 oz | 6oz | 8oz | 10oz | 12oz | |
| 105µm | 140µm | 210µm | 280µm | 315µm | 420µm | |||
| Cu Content | % | ≥99.8 | ||||||
| Boima ba Sebaka | g/m2 | 915±45 | 1120±60 | 1830±90 | 2240±120 | 3050±150 | 3660±180 | |
| Matla a tšepe | RT(23℃) | Kg/mm2 | ≥28 | |||||
| HT(180℃) | ≥15 | |||||||
| Elongation | RT(23℃) | % | ≥10 | ≥20 | ||||
| HT(180℃) | ≥5.0 | ≥10 | ||||||
| Boqhobane | E benyang(Ra) | μm | ≤0.43 | |||||
| Matte(Rz) | ≤10.1 | |||||||
| Matla a Peel | RT(23℃) | Kg/cm | ≥1.1 | |||||
| Ho fetoha ha 'mala(E-1.0hr/200℃) | % | E ntle | ||||||
| Pinhole | EA | Zero | ||||||
| Ea mantlha | Mm/inch | Ka hare Diameter 79mm/3 inch | ||||||
Hlokomela:1. Theko ea Rz ea foil ea koporo ke boleng bo tsitsitseng ba teko, eseng boleng bo tiisitsoeng.
2. Matla a Peel ke boleng bo tloaelehileng ba tlhahlobo ea boto ea FR-4 (maqephe a 5 a 7628PP).
3. Nako ea netefatso ea boleng ke matsatsi a 90 ho tloha ka letsatsi la ho amoheloa.
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