Tšireletso ea ED Copper Foils
Kenyelletso ea Sehlahisoa
Foil e tloaelehileng ea koporo ea STD e hlahisoang ke CIVEN METAL ha e na motlakase o motle feela ka lebaka la bohloeki bo phahameng ba koporo, empa hape e bonolo ho e ts'oara ebile e khona ho sireletsa mats'oao a motlakase le tšitiso ea microwave ka nepo. Ts'ebetso ea tlhahiso ea electrolytic e lumella hore ho be le bophara bo boholo ba limithara tse 1.2 kapa ho feta, ho lumella hore ho be le lisebelisoa tse feto-fetohang libakeng tse ngata tse fapaneng. Foil ea koporo ka boeona e na le sebōpeho se bataletseng haholo 'me e ka bōptjoa ka ho phethahetseng ho lisebelisoa tse ling. Foil ea koporo e boetse e hanyetsana le oxidation e phahameng ea mocheso le kutu, e etsa hore e loketse ho sebelisoa libakeng tse thata kapa bakeng sa lihlahisoa tse nang le litlhoko tse thata tsa bophelo.
Litlhaloso
CIVEN e ka fana ka 1/3oz-4oz (botenya ba lebitso 12μm -140μm) e sireletsang foil ea koporo ea electrolytic e nang le bophara bo boholo ba 1290mm, kapa lintlha tse fapaneng tsa ho sireletsa foil ea koporo ea electrolytic e nang le botenya ba 12μm -140μm ho latela litlhoko tsa bareki ba nang le boleng ba sehlahisoa. litlhoko tsa IPC-4562 maemo a II le III.
Tshebetso
Ha e na feela litšobotsi tse ntle tsa 'mele tsa kristale e ntle ea equiaxial, boemo bo tlase, matla a phahameng le bolelele bo phahameng, empa hape e na le ho hanyetsa mongobo hantle, ho hanyetsa lik'hemik'hale, mocheso oa mocheso le ho hanyetsa UV,' me e loketse ho thibela ho kena-kenana le motlakase o tsitsitseng le ho hatella motlakase. maqhubu, joalo-joalo.
Lisebelisoa
E loketse bakeng sa likoloi, matla a motlakase, likhokahano, sesole, sefofane le tse ling tse phahameng-matla oa potoloho boto, phahameng-frequency boto tlhahiso, le transformers, lik'hebole, liselefouno, lik'homphieutha, bongaka, sefofane, sesole le lihlahisoa tse ling tsa elektronike shielding.
Melemo
1, Ka lebaka la ts'ebetso e ikhethang ea sebaka sa rona sa ho hlaka, e ka thibela ho senyeha ha motlakase ka nepo.
2, Hobane sebopeho sa lijo-thollo tsa lihlahisoa tsa rona e equiaxed e ntle kristale chitja, e khutsufatsa nako ea mola etching le ho ntlafatsa bothata ba ho sa leka-lekaneng lehlakoreng etching.
3, ha e ntse e e-na le matla a phahameng a peel, ha ho phetiso ea phofo ea koporo, ts'ebetso ea tlhahiso ea PCB e hlakileng.
Tshebetso(GB/T5230-2000、IPC-4562-2000)
| Karolelano | Yuniti | 9mm | 12μm | 18μm | 35μm | 50μm | 70μm | 105μm | |
| Cu Content | % | ≥99.8 | |||||||
| Boima ba Sebaka | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | 440±8 | 585±10 | 875±15 | |
| Matla a tšepe | RT(23℃) | Kg/mm2 | ≥28 | ||||||
| HT(180℃) | ≥15 | ≥18 | ≥20 | ||||||
| Elongation | RT(23℃) | % | ≥5.0 | ≥6.0 | ≥10 | ||||
| HT(180℃) | ≥6.0 | ≥8.0 | |||||||
| Boqhobane | E benyang(Ra) | μm | ≤0.43 | ||||||
| Matte(Rz) | ≤3.5 | ||||||||
| Matla a Peel | RT(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.0 | ≥1.5 | ≥2.0 |
| Sekhahla se theohileng sa HCΦ(18%-1hr/25℃) | % | ≤7.0 | |||||||
| Ho fetoha ha 'mala(E-1.0hr/200℃) | % | E ntle | |||||||
| Solder e Phaphameng 290 ℃ | Karolo. | ≥20 | |||||||
| Ponahalo(Letheba le phofo ea koporo) | ---- | Ha ho letho | |||||||
| Pinhole | EA | Zero | |||||||
| Mamello ea Boholo | Bophara | 0 ~ 2 limilimithara | 0 ~ 2 limilimithara | ||||||
| Bolelele | ---- | ---- | |||||||
| Ea mantlha | Mm/inch | Ka hare Diameter 76mm/3 inch | |||||||
Hlokomela:1. Theko ea Rz ea foil ea koporo ke boleng bo tsitsitseng ba teko, eseng boleng bo tiisitsoeng.
2. Matla a Peel ke boleng bo tloaelehileng ba tlhahlobo ea boto ea FR-4 (maqephe a 5 a 7628PP).
3. Nako ea netefatso ea boleng ke matsatsi a 90 ho tloha ka letsatsi la ho amoheloa.
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