[RTF] Reverse Treated ED Copper Foil
![[RTF] Reverse Treated ED Copper Foil Featured Image](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil.png)
Kenyelletso ea Sehlahisoa
RTF, reverse tšoaroa electrolytic koporo foil ke koporo foil hore e 'nile ea roughened ka likhato tse sa tšoaneng mahlakoreng ka bobeli. Sena se matlafatsa matla a lekhapetla la mahlakore ka bobeli a foil ea koporo, ho etsa hore ho be bonolo ho e sebelisa e le lera le bohareng bakeng sa ho tlamahanngoa le lisebelisoa tse ling. Ho feta moo, maemo a fapaneng a kalafo ka mahlakoreng ka bobeli a foil ea koporo a etsa hore ho be bonolo ho beha lehlakore le lesesaane la lera le roughened. Nakong ea ho etsa phanele ea potoloho e hatisitsoeng (PCB), lehlakoreng le tšoaroang la koporo le sebelisoa ho lisebelisoa tsa dielectric. Lehlakore la moropa le tšoaroang le thata ho feta lehlakore le leng, e leng se etsang hore ho be le sekhomaretsi se seholo ho dielectric. Ena ke eona molemo o moholo ho feta koporo e tloaelehileng ea electrolytic. Lehlakore la matte ha le hloke phekolo ea mechine kapa ea lik'hemik'hale pele ho kopo ea photoresist. E se e ntse e le thata ka ho lekaneng ho ba le ho khomarela hantle laminating.
Litlhaloso
CIVEN e ka fana ka RTF electrolytic koporo foil e nang le botenya ba 12 ho isa ho 35µm ho fihla ho 1295mm bophara.
Tshebetso
Thecheso e phahameng ea mocheso e khutlisitsoeng e phekotsoeng ea koporo ea electrolytic e tlas'a ts'ebetso e nepahetseng ea ho rala ho laola boholo ba lihlahala tsa koporo le ho li aba ka ho lekana. Bokaholimo bo ts'oaroang bo khanyang ba foil ea koporo bo ka fokotsa haholo bohale ba foil ea koporo e hatelletsoeng hammoho le ho fana ka matla a lekaneng a lekhapetla la foil ea koporo. (Sheba Letlapa la 1)
Lisebelisoa
E ka sebelisoa bakeng sa lihlahisoa tse phahameng haholo le li-laminate tse ka hare, joalo ka liteishene tsa 5G le radar ea likoloi le lisebelisoa tse ling.
Melemo
Matla a maqhama a matle, lamination e tobileng ea li-multi-layer, le ts'ebetso e ntle ea etching. E boetse e fokotsa monyetla oa potoloho e khuts'oane mme e khutsufatsa nako ea potoloho ea ts'ebetso.
Letlapa la 1. Tshebetso
| Karolelano | Yuniti | 1/3OZ (12μm) | 1/2OZ (18μm) | 1OZ (35μm) | |
| Cu Content | % | min. 99.8 | |||
| Boima ba Sebaka | g/m2 | 107±3 | 153±5 | 283±5 | |
| Matla a tšepe | RT(25℃) | Kg/mm2 | min. 28.0 | ||
| HT(180℃) | min. 15.0 | min. 15.0 | min. 18.0 | ||
| Elongation | RT(25℃) | % | min. 5.0 | min. 6.0 | min. 8.0 |
| HT(180℃) | min. 6.0 | ||||
| Boqhobane | E benyang(Ra) | μm | max. 0.6/4.0 | max. 0.7/5.0 | max. 0.8/6.0 |
| Matte(Rz) | max. 0.6/4.0 | max. 0.7/5.0 | max. 0.8/6.0 | ||
| Matla a Peel | RT(23℃) | Kg/cm | min. 1.1 | min. 1.2 | min. 1.5 |
| Sekhahla se theohileng sa HCΦ(18%-1hr/25℃) | % | max. 5.0 | |||
| Ho fetoha ha 'mala(E-1.0hr/190℃) | % | Ha ho letho | |||
| Solder e Phaphameng 290 ℃ | Karolo. | max. 20 | |||
| Pinhole | EA | Zero | |||
| Preperg | ---- | FR-4 | |||
Hlokomela:1. Theko ea Rz ea foil ea koporo ke boleng bo tsitsitseng ba teko, eseng boleng bo tiisitsoeng.
2. Matla a Peel ke boleng bo tloaelehileng ba tlhahlobo ea boto ea FR-4 (maqephe a 5 a 7628PP).
3. Nako ea netefatso ea boleng ke matsatsi a 90 ho tloha ka letsatsi la ho amoheloa.
![[BCF] Betri ED Copper Foil](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
![[VLP] Boemo bo tlase haholo ED Copper Foil](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
![[HTE] Elongation e Phahameng ED Copper Foil](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)
