[RTF] Foil ea Koporo ea ED e Phekotsoeng ka Morao
![[RTF] Setšoantšo se Hlahisitsoeng sa Foil ea Koporo ea ED e Phekotsoeng ka Morao](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil.png)
Selelekela sa Sehlahisoa
RTF, foil ea koporo e phekoloang ka morao ke foil ea koporo e ruruhileng ka tekanyo e fapaneng mahlakoreng ka bobeli. Sena se matlafatsa matla a ho phunya mahlakoreng ka bobeli a foil ea koporo, e leng se etsang hore ho be bonolo ho e sebelisa e le lera le bohareng bakeng sa ho hokahana le lisebelisoa tse ling. Ho feta moo, maemo a fapaneng a kalafo mahlakoreng ka bobeli a foil ea koporo a etsa hore ho be bonolo ho phunya lehlakore le lesesaane la lera le ruruhileng. Ts'ebetsong ea ho etsa phanele ea boto ea potoloho e hatisitsoeng (PCB), lehlakore le phekoloang la koporo le sebelisoa thepa ea dielectric. Lehlakore la moropa le phekoloang le ruruhile ho feta lehlakore le leng, e leng se etsang hore ho khomareloe haholoanyane ho dielectric. Ena ke molemo o moholo ho feta koporo e tloaelehileng ea electrolytic. Lehlakore la matte ha le hloke kalafo efe kapa efe ea mechine kapa ea lik'hemik'hale pele ho sebelisoa photoresist. E se e ntse e ruruhile ho lekana ho ba le ho khomarela ho hotle ha laminating resist.
Litlhaloso
CIVEN e ka fana ka foil ea koporo ea RTF ea electrolytic ka botenya bo tloaelehileng ba 12 ho isa ho 35µm ho fihlela ho 1295mm.
Tshebetso
Foil ea koporo e phekotsoeng ka motlakase e khutlisetsoang morao mochesong o phahameng e etsoa ka mokhoa o nepahetseng oa ho polata ho laola boholo ba lihlahala tsa koporo le ho li aba ka ho lekana. Bokaholimo bo khanyang bo phekotsoeng ka morao ba foil ea koporo bo ka fokotsa haholo ho teteana ha foil ea koporo e hatelitsoeng hammoho le ho fana ka matla a lekaneng a ho khetla a foil ea koporo. (Sheba Tafole ea 1)
Likopo
E ka sebelisoa bakeng sa lihlahisoa tse nang le maqhubu a phahameng le li-laminate tsa kahare, tse kang liteishene tsa motheo tsa 5G le radar ea likoloi le lisebelisoa tse ling.
Melemo
Matla a matle a ho kopanya, ho lamination e tobileng ea mekhahlelo e mengata, le ts'ebetso e ntle ea ho fata. E boetse e fokotsa monyetla oa potoloho e khuts'oane le ho khutsufatsa nako ea potoloho ea ts'ebetso.
Tafole ea 1. Tshebetso
| Tlhophiso | Yuniti | 1/3OZ (12μm) | 1/2OZ (18μm) | 1OZ (35μm) | |
| Dikahare tsa Cu | % | bonyane 99.8 | |||
| Boima ba Sebaka | g/m2 | 107±3 | 153±5 | 283±5 | |
| Matla a tšepe | RT(25℃) | Kg/mm2 | bonyane 28.0 | ||
| HT(180℃) | bonyane 15.0 | bonyane 15.0 | bonyane 18.0 | ||
| Ho lelefatsa | RT(25℃) | % | bonyane 5.0 | bonyane 6.0 | bonyane 8.0 |
| HT(180℃) | bonyane 6.0 | ||||
| Ho ba le makukuno | Benyang(Ra) | μm | palo e kahodimodimo 0.6/4.0 | palo e kahodimodimo 0.7/5.0 | palo e kahodimodimo 0.8/6.0 |
| Matte(Rz) | palo e kahodimodimo 0.6/4.0 | palo e kahodimodimo 0.7/5.0 | palo e kahodimodimo 0.8/6.0 | ||
| Matla a ho Hloekisa | RT(23℃) | Kg/cm | bonyane 1.1 | bonyane 1.2 | bonyane 1.5 |
| Sekhahla se fokotsehileng sa HCΦ(18%-1hr/25℃) | % | palo e kahodimodimo. 5.0 | |||
| Phetoho ea 'mala (E-1.0hr/190℃) | % | Ha ho letho | |||
| Solder e Phaphametseng 290℃ | Sek. | palo e kahodimodimo ea 20 | |||
| Lesoba la Pinhole | EA | Lefela | |||
| Preperg | ---- | FR-4 | |||
Hlokomela:1. Boleng ba Rz ba bokaholimo ba koporo ke boleng bo tsitsitseng ba teko, ha se boleng bo tiisitsoeng.
2. Matla a ho kgephoha ke boleng bo tloaelehileng ba teko ya boto ya FR-4 (maqephe a 5 a 7628PP).
3. Nako ea netefatso ea boleng ke matsatsi a 90 ho tloha ka letsatsi la ho amoheloa.
![[HTE] Foil ea Koporo ea ED e Telele e Phahameng](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)
![[BCF] Betri ED Foil ea Koporo](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
![[VLP] Foil ea Koporo ea ED e nang le Profaele e Tlase Haholo](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
