[HTE] Foil ea Koporo ea ED e Telele e Phahameng
![[HTE] Foil ea Koporo ea ED e Telele e Phahameng Setšoantšo se Hlahisitsoeng](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil.png)
Selelekela sa Sehlahisoa
HTE, mocheso o phahameng le ho lelefala foil ea koporo e hlahisoang keTŠEPE EA CIVENe na le khanyetso e babatsehang mochesong o phahameng le ho teteana ho hoholo. Foil ea koporo ha e oxidize kapa ha e fetole 'mala mochesong o phahameng, 'me ho teteana ha eona ho hotle ho etsa hore ho be bonolo ho e laminate ka thepa e meng. Foil ea koporo e hlahisoang ke ts'ebetso ea electrolysis e na le bokaholimo bo hloekileng haholo le sebopeho sa lakane e bataletseng. Foil ea koporo ka boeona e ferekane ka lehlakoreng le leng, e leng se etsang hore ho be bonolo ho khomarela thepa e meng. Bohloeki ka kakaretso ba foil ea koporo bo phahame haholo, 'me e na le motlakase o motle oa motlakase le oa mocheso. E le ho fihlela litlhoko tsa bareki ba rona, re ka fana eseng feela ka meqolo ea foil ea koporo, empa hape le ka lits'ebeletso tsa ho seha tse ikhethileng.
Litlhaloso
Botenya: 1/4OZ～20OZ(9µm～70µm)
Bophara: 550mm～1295mm
Tshebetso
Sehlahisoa se na le ts'ebetso e ntle ea polokelo ea mocheso oa kamore, ts'ebetso ea ho hanyetsa oxidation mochesong o phahameng, boleng ba sehlahisoa ho fihlela maemo a IPC-4562Ⅱ, Ⅲlitlhoko tsa boemo.
Likopo
E loketse mefuta eohle ea sistimi ea resin ea boto ea potoloho e hatisitsoeng e nang le mahlakore a mabeli, e nang le mekhahlelo e mengata
Melemo
Sehlahisoa se amohela mokhoa o khethehileng oa kalafo ea bokaholimo ho ntlafatsa bokhoni ba sehlahisoa ba ho hanela mafome a ka tlase le ho fokotsa kotsi ea masala a koporo.
Tshebetso (GB/T5230-2000、IPC-4562-2000)
| Tlhophiso | Yuniti | 1/4OZ (9μm) | 1/3OZ (12μm) | J OZ (15μm) | 1/2OZ (18μm) | 1OZ (35μm) | 2OZ (70μm) | |
| Dikahare tsa Cu | % | ≥99.8 | ||||||
| Boima ba Sebaka | g/m2 | 80±3 | 107±3 | 127±4 | 153±5 | 283±5 | 585±10 | |
| Matla a tšepe | RT(25℃) | Kg/mm2 | ≥28 | ≥30 | ||||
| HT(180℃) | ≥15 | |||||||
| Ho lelefatsa | RT(25℃) | % | ≥4.0 | ≥5.0 | ≥6.0 | ≥10 | ||
| HT(180℃) | ≥4.0 | ≥5.0 | ≥6.0 | |||||
| Ho ba le makukuno | Benyang(Ra) | μm | ≤0.4 | |||||
| Matte(Rz) | ≤5.0 | ≤6.0 | ≤7.0 | ≤7.0 | ≤9.0 | ≤14 | ||
| Matla a ho Hloekisa | RT(23℃) | Kg/cm | ≥1.0 | ≥1.2 | ≥1.2 | ≥1.3 | ≥1.8 | ≥2.0 |
| Sekhahla se fokotsehileng sa HCΦ(18%-1hr/25℃) | % | ≤5.0 | ||||||
| Phetoho ea 'mala (E-1.0hr/190℃) | % | Ho lokile | ||||||
| Solder e Phaphametseng 290℃ | Sek. | ≥20 | ||||||
| Lesoba la Pinhole | EA | Lefela | ||||||
| Preperg | ---- | FR-4 | ||||||
Hlokomela:1. Boleng ba Rz ba bokaholimo ba koporo ke boleng bo tsitsitseng ba teko, ha se boleng bo tiisitsoeng.
2. Matla a ho kgephoha ke boleng bo tloaelehileng ba teko ya boto ya FR-4 (maqephe a 5 a 7628PP).
3. Nako ea netefatso ea boleng ke matsatsi a 90 ho tloha ka letsatsi la ho amoheloa.
![[VLP] Foil ea Koporo ea ED e nang le Profaele e Tlase Haholo](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
![[RTF] Foil ea Koporo ea ED e Phekotsoeng ka Morao](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
![[BCF] Betri ED Foil ea Koporo](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
