[HTE] Elongation e Phahameng ED Copper Foil
![[HTE] High Elongation ED Copper Foil Featured Image](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil.png)
Kenyelletso ea Sehlahisoa
HTE, mocheso o phahameng le bolelele foil ea koporo e hlahisoang keCIVEN TŠEPEe na le khanyetso e babatsehang ho mocheso o phahameng le ductility e phahameng. Foil ea koporo ha e oxidize kapa e fetola 'mala ka mocheso o phahameng,' me ductility ea eona e ntle e etsa hore ho be bonolo ho laminate ka lisebelisoa tse ling. Foil ea koporo e hlahisoang ke ts'ebetso ea electrolysis e na le sebaka se hloekileng haholo le sebopeho sa sheet sheet. The foil koporo ka boeona e roughened ka lehlakoreng le leng, e leng ho etsa hore ho be bonolo ho khomarela lisebelisoa tse ling. Bohloeki ka kakaretso ba foil ea koporo bo phahame haholo, 'me e na le motlakase o motle haholo oa motlakase le oa mocheso. E le hore re finyelle litlhoko tsa bareki ba rona, re ka fana ka meqolo feela ea foil ea koporo, empa hape le litšebeletso tse entsoeng ka mokhoa o ikhethileng.
Litlhaloso
Botenya: 1/4OZ～20OZ(9µm～70µm)
Bophara: 550mm～1295 limilimithara
Tshebetso
Sehlahisoa se na le ts'ebetso e ntle ea polokelo ea mocheso oa kamore, ts'ebetso e phahameng ea mocheso oa oxidation, boleng ba sehlahisoa ho fihlela maemo a IPC-4562.Ⅱ, Ⅲditlhoko tsa boemo.
Lisebelisoa
E loketse mefuta eohle ea sistimi ea resin ea boto ea potoloho e nang le mahlakore a mabeli, e hatisitsoeng ka bongata
Melemo
Sehlahisoa se nka mokhoa o khethehileng oa phekolo ea holim'a metsi ho ntlafatsa bokhoni ba sehlahisoa sa ho hanyetsa ho senyeha ha tlase le ho fokotsa kotsi ea masala a koporo.
Tshebetso(GB/T5230-2000、IPC-4562-2000)
| Karolelano | Yuniti | 1/4OZ (9μm) | 1/3OZ (12μm) | J OZ (15μm) | 1/2OZ (18μm) | 1OZ (35μm) | 2OZ (70μm) | |
| Cu Content | % | ≥99.8 | ||||||
| Boima ba Sebaka | g/m2 | 80±3 | 107±3 | 127±4 | 153±5 | 283±5 | 585±10 | |
| Matla a tšepe | RT(25℃) | Kg/mm2 | ≥28 | ≥30 | ||||
| HT(180℃) | ≥15 | |||||||
| Elongation | RT(25℃) | % | ≥4.0 | ≥5.0 | ≥6.0 | ≥10 | ||
| HT(180℃) | ≥4.0 | ≥5.0 | ≥6.0 | |||||
| Boqhobane | E benyang(Ra) | μm | ≤0.4 | |||||
| Matte(Rz) | ≤5.0 | ≤6.0 | ≤7.0 | ≤7.0 | ≤9.0 | ≤14 | ||
| Matla a Peel | RT(23℃) | Kg/cm | ≥1.0 | ≥1.2 | ≥1.2 | ≥1.3 | ≥1.8 | ≥2.0 |
| Sekhahla se theohileng sa HCΦ(18%-1hr/25℃) | % | ≤5.0 | ||||||
| Ho fetoha ha 'mala(E-1.0hr/190℃) | % | E ntle | ||||||
| Solder e Phaphameng 290 ℃ | Karolo. | ≥20 | ||||||
| Pinhole | EA | Zero | ||||||
| Preperg | ---- | FR-4 | ||||||
Hlokomela:1. Theko ea Rz ea foil ea koporo ke boleng bo tsitsitseng ba teko, eseng boleng bo tiisitsoeng.
2. Matla a Peel ke boleng bo tloaelehileng ba tlhahlobo ea boto ea FR-4 (maqephe a 5 a 7628PP).
3. Nako ea netefatso ea boleng ke matsatsi a 90 ho tloha ka letsatsi la ho amoheloa.
![[VLP] Boemo bo tlase haholo ED Copper Foil](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
![[RTF] Reverse Treated ED Copper Foil](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
![[BCF] Betri ED Copper Foil](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)