Li-foil tsa koporo tsa ED bakeng sa FPC
Selelekela sa Sehlahisoa
FCF, e tenyetsehangfoil ea koporo e ntshetswa pele le ho etswa ka ho kgetheha bakeng sa indasteri ya FPC (FCCL). Foil ena ya koporo ya electrolytic e na le bokgoni bo betere ba ho teteana, ho ba thata ho tlase le matla a ho hlohlora a betere ho fetatse ling foil ea koporosKa nako e ts'oanang, qetello ea bokaholimo le botenya ba foil ea koporo li betere 'me khanyetso ea ho mena e molemo haholo.hapee betere ho feta dihlahiswa tse tshwanang tsa koporo. Kaha foil ena ya koporo e itshetlehile hodima tshebetso ya electrolytic, ha e na mafura, e leng se etsang hore ho be bonolo ho kopanngwa le thepa ya TPI maemong a lehodimo.
Tekanyo ea Tekanyo:
Botenya:9µm～35µm
Tshebetso
Bokaholimo ba sehlahisoa bo botsho kapa bo bofubelu, bo na le ho se tsitse ha bokaholimo.
Likopo
Fokotsa ea Koporo e Fetohang ea Laminate (FCCL), Fine Circuit FPC, Filimi e tšesaane ea kristale e koahetsoeng ka LED.
Likaroloana:
Sekhahla se phahameng, khanyetso e phahameng ea ho kobeha le ts'ebetso e ntle ea ho fata.
Sebopeho se senyenyane:
SEM (Lehlakore le Bobe ka mor'a Kalafo)
SEM (Pele ho Phekolo ea Bokaholimo)
SEM (Lehlakore le benyang kamora Phekolo)
Tafole 1- Tshebetso (GB/T5230-2000、IPC-4562-2000):
| Tlhophiso | Yuniti | 9μm | 12μm | 18μm | 35μm | |
| Dikahare tsa Cu | % | ≥99.8 | ||||
| Boima ba Sebaka | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | |
| Matla a tšepe | RT(23℃) | Kg/mm2 | ≥28 | |||
| HT(180℃) | ≥15 | ≥15 | ≥15 | ≥18 | ||
| Ho lelefatsa | RT(23℃) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 |
| HT(180℃) | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ||
| Ho ba le makukuno | Benyang(Ra) | μm | ≤0.43 | |||
| Matte(Rz) | ≤2.5 | |||||
| Matla a ho Hloekisa | RT(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.8 | ≥0.8 |
| Sekhahla se fokotsehileng sa HCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||
| Phetoho ea 'mala (E-1.0hr/200℃) | % | Ho lokile | ||||
| Solder e Phaphametseng 290℃ | Sek. | ≥20 | ||||
| Ponahalo (phofo ea Spot le koporo) | ---- | Ha ho letho | ||||
| Lesoba la Pinhole | EA | Lefela | ||||
| Mamello ea Boholo | Bophara | mm | 0 ~ 2mm | |||
| Bolelele | mm | ---- | ||||
| Core | Mm/intshi | Bophara ba kahare 79mm/3 inch | ||||
Ela Hloko: 1. Tshebetso ya ho hanyetsa ho kenngwa ha oksideishene ya koporo le index ya botenya ba bokahodimo di ka buisanwa.
2. Tekanyetso ea ts'ebetso e ipapisitse le mokhoa oa rona oa teko.
3. Nako ea tiisetso ea boleng ke matsatsi a 90 ho tloha ka letsatsi la ho amoheloa.
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![[RTF] Foil ea Koporo ea ED e Phekotsoeng ka Morao](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
![[HTE] Foil ea Koporo ea ED e Telele e Phahameng](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)
![[BCF] Betri ED Foil ea Koporo](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
