IOS Certificate China Hte Ra Rolled Annealed Copper Foil for PCB Ccl
Re itšetlehile ka matla a matla a tekheniki 'me re tsoela pele ho theha mahlale a tsoetseng pele ho fihlela tlhoko ea Setifikeiti sa IOS China Hte Ra Rolled Annealed Copper Foil bakeng sa PCB Ccl, Thepa ea rona e tsebahala haholo ebile e tšepahala ke basebelisi 'me e ka khotsofatsa litlhoko tse lulang li fetoha tsa moruo le tsa sechaba.
Re itšetlehile ka matla a matla a tekheniki 'me re lula re theha mahlale a tsoetseng pele ho fihlela tlhoko eaChina Copper Foil, Foil ea koporo e kentsoeng, Re labalabela ho sebelisana le lik'hamphani tsa kantle ho naha tse tsotellang haholo boleng ba 'nete, phepelo e tsitsitseng, bokhoni bo matla le tšebeletso e ntle. Re ka fana ka theko ea tlholisano ka ho fetesisa ka boleng bo holimo, hobane re bile Litsebi tse EKETSEHILENG. U amoheloa ho etela k'hamphani ea rona ka nako efe kapa efe.
Kenyelletso ea Sehlahisoa
Lihlahisoa tsa koporo tse pepesehileng moeeng li na le tšekamelo ea ho ba le oxidation le ho thehoa ha carbonate ea koporo ea motheo, e nang le khanyetso e phahameng, ho se sebetse hantle ha motlakase le tahlehelo e phahameng ea phetisetso ea matla; ka mor'a ho roala tin, lihlahisoa tsa koporo li etsa lifilimi tsa tin dioxide moeeng ka lebaka la thepa ea tšepe ka boeona ho thibela oxidation e eketsehileng. Tin e ka boela ea theha filimi e tšoanang ka halogen, e le hore lihlahisoa tsa koporo ka mor'a ho roala li na le ho hanyetsa kutu le ho cheseha hantle, 'me ka nako e ts'oanang li na le matla a itseng le boima, kahoo li sebelisoa haholo lihlahisoa tsa indasteri ea motlakase le ea elektronike; hobane tšepe ea thini ha e na chefo ebile ha e na tatso, lihlahisoa ka mor'a ho roala li boetse li sebelisoa haholo indastering ea lijo. Foil e entsoeng ka koporo e entsoeng ke CIVEN METAL e na le sepakapaka se setle le botenya ba lesela la tin. Li ka khangoa 'me tsa petsoha ho latela litlhoko tsa bareki.
Boitsebiso ba Motheo
● Ho nepahala ho phahamengFoil ea koporo e kentsoeng, Cu(JIS: C1100/ASTM: C11000) dikahare ho feta 99.96%
Base Material Thickness Range
● 0.035mm~0.15mm (0.0013 ~0.0059inches)
Base Material Width Range
● ≤300mm (≤11.8 inch)
Base Material Temper
● Ho ea ka litlhoko tsa bareki
Kopo
● Indasteri ea lisebelisoa tsa motlakase le ea elektronike, ea sechaba (e kang: ho paka lino le lisebelisoa tsa ho kopana le lijo);
Mekhahlelo ea Ts'ebetso
Lintho | Thepa ea Tin e chesehang | Sekhahla sa Tin se sa cheseheleng |
Bophara Range | ≤600mm (≤23.62inch) | |
Botenya Range | 0.012~0.15mm (0.00047inches~0.0059inches) | |
Tin layer Botenya | ≥0.3µm | ≥0.2µm |
Likahare tsa Tin tsa Lera la Tin | 65 ~ 92% (E ka fetola litaba tsa thini ho latela ts'ebetso ea tjheseletsa ea bareki) | 100% Tin e Hloekileng |
Bokaholimo bo hanyetsanang le Lera la Tin(Ω) | 0.3~0.5 | 0.1~0.15 |
Ho khomarela | 5B | |
Matla a tšepe | Base Material Attenuation ka mor'a Plating ≤10% | |
Elongation | Base Material Attenuation After Plating ≤6% |
Re itšetlehile ka matla a matla a tekheniki 'me re tsoela pele ho theha mahlale a tsoetseng pele ho fihlela tlhoko ea Setifikeiti sa IOS China Hte Ra Rolled Annealed Copper Foil bakeng sa PCB Ccl, Thepa ea rona e tsebahala haholo ebile e tšepahala ke basebelisi 'me e ka khotsofatsa litlhoko tse lulang li fetoha tsa moruo le tsa sechaba.
Setifikeiti sa IOSChina Copper Foil, Rolled Copper Foil, Re labalabela ho sebelisana le lik'hamphani tsa kantle ho naha tse tsotellang haholo boleng ba 'nete, phepelo e tsitsitseng, bokhoni bo matla le ts'ebeletso e ntle. Re ka fana ka theko ea tlholisano ka ho fetesisa ka boleng bo holimo, hobane re bile Litsebi tse EKETSEHILENG. U amoheloa ho etela k'hamphani ea rona ka nako efe kapa efe.