Boleng bo botle China OEM Manufacturer Electromagnetic Shielding ED Copper Foil
Khampani ea rona ho tloha ha e thehoa, hangata e nka sehlahisoa sa boleng bo holimo e le bophelo ba k'hamphani, e lula e matlafatsa theknoloji ea tlhahiso, e matlafatsa sehlahisoa se setle le ho tsoela pele ho matlafatsa tsamaiso e babatsehang ea k'hamphani, ka ho latela melao-motheo ea naha ea ISO 9001:2000 bakeng sa boleng bo botle ba China OEM Manufacturer Electromagnetic. Sireletsa ED Copper Foil, Re tšepa ka tieo ho theha litloaelano tse khotsofatsang hammoho le uena ho tloha haufinyane. Re tla u tsebisa ka tsoelo-pele ea rona 'me re lule re le malala-a-laotsoe bakeng sa ho haha likamano tse tsitsitseng tsa mokhatlo hammoho le uena.
Khampani ea rona ho tloha ha e qala, hangata e nka sehlahisoa sa boleng bo holimo e le bophelo ba k'hamphani, e lula e matlafatsa theknoloji ea tlhahiso, e matlafatsa sehlahisoa ka mokhoa o tsoileng matsoho, 'me e tsoela pele ho matlafatsa tsamaiso e ntle ka ho fetesisa ea khamphani, ho latela melao e thata e sebelisang maemo a naha a ISO 9001:2000China Copper Foil, Theipi ea Koporo, Etsa bonnete ba hore u ikutloa u lokolohile ho re romella lintlha tsa hau mme re tla u araba kapele. Re na le sehlopha sa boenjiniere ba litsebi ho sebeletsa litlhoko tsohle tse qaqileng. Mehlala ea mahala e ka romelloa uena ka bouena ho tseba lintlha tse ngata. E le hore u tsebe ho finyella litakatso tsa hau, u lokela ho ikutloa u lokolohile ho ikopanya le rona. O ka re romella mangolo-tsoibila mme oa re letsetsa hang-hang. Ho feta moo, re thabela ho etela fektheri ea rona ho tsoa lefats'eng lohle bakeng sa ho tsebahatsa mokhatlo oa rona hamolemo. le thepa. Khoebong ea rona le bahoebi ba linaha tse 'maloa, hangata re khomarela molao-motheo oa ho lekana le ho thusana. Ke tšepo ea rona ho rekisa, ka boiteko bo kopanetsoeng, khoebo le setsoalle molemong oa rona. Re labalabela ho fumana lipotso tsa hau.
Kenyelletso ea Sehlahisoa
Electrolytic copper foil bakeng sa FPC e ntshetswa pele le ho etsetswa indasteri ya FPC (FCCL). Foil ena ea koporo e nang le electrolytic e na le ductility e betere, mahoashe a tlase le matla a betere a lekhapetla ho feta likhalase tse ling tsa koporo. Ka nako e ts'oanang, qetello ea bokaholimo le bokhabane ba foil ea koporo e molemo 'me ho hanyetsa ho phutha ho boetse ho molemo ho feta lihlahisoa tse tšoanang tsa koporo ea koporo. Kaha foil ena ea koporo e thehiloe ts'ebetsong ea electrolytic, ha e na mafura, e leng se etsang hore ho be bonolo ho kopanngoa le lisebelisoa tsa TPI ka mocheso o phahameng.
Dimension Range
Botenya: 9µm～35µm
Lits'ebetso
Sebaka sa sehlahisoa se ntšo kapa se khubelu, se na le mahoashe a tlaase.
Lisebelisoa
Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED e koahetsoeng ka filimi e tšesaane ea kristale.
Likaroloana
Boima bo phahameng, khanyetso e phahameng ea ho kobeha le ts'ebetso e ntle ea etching.
Microstructure
SEM (Pele ho Phekolo ea Bokaholimo)
SEM (Lehlakore le Benyang ka mor'a Phekolo)
SEM (Lehlakore le Lebe kamora Kalafo)
Table1- Tshebetso (GB/T5230-2000、IPC-4562-2000)
| Karolelano | Yuniti | 9mm | 12μm | 18μm | 35μm | |
| Cu Content | % | ≥99.8 | ||||
| Boima ba Sebaka | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | |
| Matla a tšepe | RT(23℃) | Kg/mm2 | ≥28 | |||
| HT(180℃) | ≥15 | ≥15 | ≥15 | ≥18 | ||
| Elongation | RT(23℃) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 |
| HT(180℃) | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ||
| Boqhobane | E benyang(Ra) | μm | ≤0.43 | |||
| Matte(Rz) | ≤2.5 | |||||
| Matla a Peel | RT(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.8 | ≥0.8 |
| Sekhahla se fokolisitsoeng sa HCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||
| Ho fetoha ha 'mala(E-1.0hr/200℃) | % | E ntle | ||||
| Solder e Phaphameng 290 ℃ | Karolo. | ≥20 | ||||
| Ponahalo(Letheba le phofo ea koporo) | —- | Ha ho letho | ||||
| Pinhole | EA | Zero | ||||
| Mamello ea Boholo | Bophara | mm | 0 ~ 2 limilimithara | |||
| Bolelele | mm | —- | ||||
| Ea mantlha | Mm/inch | Ka hare Diameter 79mm/3 inch | ||||
Hlokomela:1. Ts'ebetso ea koporo ea foil oxidation resistance le index density index li ka buisanoa.
2. Lenane la tšebetso le itšetlehile ka mokhoa oa rona oa teko.
3. Nako ea tiiso ea boleng ke matsatsi a 90 ho tloha letsatsing la ho fumana.
Khampani ea rona ho tloha ha e thehoa, hangata e nka sehlahisoa sa boleng bo holimo e le bophelo ba k'hamphani, e lula e matlafatsa theknoloji ea tlhahiso, e matlafatsa sehlahisoa se setle le ho tsoela pele ho matlafatsa tsamaiso e babatsehang ea k'hamphani, ka ho latela melao-motheo ea naha ea ISO 9001:2000 bakeng sa boleng bo botle ba China OEM Manufacturer Electromagnetic. Sireletsa ED Copper Foil, Re tšepa ka tieo ho theha litloaelano tse khotsofatsang hammoho le uena ho tloha haufinyane. Re tla u tsebisa ka tsoelo-pele ea rona 'me re lule re le malala-a-laotsoe bakeng sa ho haha likamano tse tsitsitseng tsa mokhatlo hammoho le uena.
Boleng bo botleChina Copper Foil, Theipi ea Koporo, Etsa bonnete ba hore u ikutloa u lokolohile ho re romella lintlha tsa hau mme re tla u araba kapele. Re na le sehlopha sa boenjiniere ba litsebi ho sebeletsa litlhoko tsohle tse qaqileng. Mehlala ea mahala e ka romelloa uena ka bouena ho tseba lintlha tse ngata. E le hore u tsebe ho finyella litakatso tsa hau, u lokela ho ikutloa u lokolohile ho ikopanya le rona. O ka re romella mangolo-tsoibila mme oa re letsetsa hang-hang. Ho feta moo, re thabela ho etela fektheri ea rona ho tsoa lefats'eng lohle bakeng sa ho tsebahatsa mokhatlo oa rona hamolemo. le thepa. Khoebong ea rona le bahoebi ba linaha tse 'maloa, hangata re khomarela molao-motheo oa ho lekana le ho thusana. Ke tšepo ea rona ho rekisa, ka boiteko bo kopanetsoeng, khoebo le setsoalle molemong oa rona. Re labalabela ho fumana lipotso tsa hau.
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