< img height="1" width="1" style="display:none" src="https://www.facebook.com/tr?id=1663378561090394&ev=PageView&noscript=1" /> Feme e Molemo ka ho Fetisisa e Rekisang China Electrolytic Copper Foil bakeng sa Battery Anode Substrate Manufacturer le Feme | Civen

Feme e Rekisang China Electrolytic Copper Foil bakeng sa Battery Anode Substrate

Tlhaloso e Khutšoanyane:

Nickel tšepe e na le botsitso bo phahameng moeeng, bokhoni bo matla ba passivation, bo ka etsa filimi e tšesaane haholo ea passivation moeeng, e ka hanela ho bola ha alkali le acid, e le hore sehlahisoa se tsitsitse lik'hemik'hale mosebetsing le tikolohong ea alkaline, ha ho bonolo ho senya, e be oxidized feela ka holimo ho 600 ℃; nickel plating layer e na le sekhomaretsi se matla, ha ho bonolo ho oela; nickel plating layer e ka etsa hore bokaholimo ba lintho bo be thata, bo ka ntlafatsa ho hanyetsa ha sehlahisoa le acid le alkali corrosion resistance, sehlahisoa se apereng ho hanyetsa, kutu, ts'ebetso ea ho thibela mafome e ntle haholo.


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Tsoelo-pele ea rona e ipapisitse le lisebelisoa tse ntlafalitsoeng haholo, litalenta tse hloahloa le matla a mahlale a matlafatsoa khafetsa bakeng sa Fektheri e Rekisang China Electrolytic Copper Foil bakeng sa Battery Anode Substrate, phaello le menyaka ea Bareki e lula e le sepheo sa rona se seholo. O lokela ho iteanya le rona. Re fe monyetla, re u fe ntho e makatsang.
Tsoelo-pele ea rona e itšetlehile ka lisebelisoa tse tsoetseng pele haholo, litalenta tse babatsehang le matla a theknoloji a tsoelang pele a matlafalitsoeng bakeng saGn-Bccf, Re motlotlo ho fana ka lihlahisoa tsa rona ho moetsi e mong le e mong oa likoloi lefatšeng ka bophara ka lits'ebeletso tsa rona tse tenyetsehang, tse sebetsang ka potlako le maemo a thata a taolo a boleng ao esale a amoheloa le ho rorisoa ke bareki.

Kenyelletso ea Sehlahisoa

Nickel tšepe e na le botsitso bo phahameng moeeng, bokhoni bo matla ba passivation, bo ka etsa filimi e tšesaane haholo ea passivation moeeng, e ka hanela ho bola ha alkali le acid, e le hore sehlahisoa se tsitsitse lik'hemik'hale mosebetsing le tikolohong ea alkaline, ha ho bonolo ho senya, e be oxidized feela ka holimo ho 600 ℃; nickel plating layer e na le sekhomaretsi se matla, ha ho bonolo ho oela; nickel plating layer e ka etsa hore bokaholimo ba lintho bo be thata, bo ka ntlafatsa ho hanyetsa ha sehlahisoa le acid le alkali corrosion resistance, sehlahisoa se apereng ho hanyetsa, kutu, ts'ebetso ea ho thibela mafome e ntle haholo. Ka lebaka la boima bo phahameng ba holim'a lihlahisoa tse entsoeng ka nickel, likristale tse nang le nickel plated li ntle haholo, li na le polishability e phahameng, polishing e ka fihla ponahalong ea seiponeng, sepakapakeng se ka bolokoa ka nako e telele e hloekile, kahoo e boetse e sebelisoa hangata bakeng sa mokhabiso. Nickel e entsoeng ka koporo ea koporo e hlahisoang ke CIVEN METAL e na le sepakapaka se setle haholo le sebopeho se bataletseng. Li boetse li na le degreased 'me li ka etsoa laminated habonolo ka lisebelisoa tse ling. Ka nako e ts'oanang, re ka boela ra etsa foil ea rona ea koporo e entsoeng ka nickel ka ho e khaola le ho e petsola ho latela litlhoko tsa bareki.

Boitsebiso ba Motheo

● Lesela la Koporo le Phalehileng (JIS:C1100/ASTM:C11000) Cu content ho feta 99.96%

Base Material Thickness Range

● 0.012mm~0.15mm (0.00047inches~0.0059inches)

Base Material Width Range

● ≤600mm (≤23.62inch)

Base Material Temper

● Ho ea ka litlhoko tsa bareki

Kopo

● Lisebelisoa tsa motlakase, lisebelisoa tsa elektronike, libeteri, likhokahano, hardware le liindasteri tse ling;

Mekhahlelo ea Ts'ebetso

Lintho

E ka sebetsoaNickelHo roala

E sa chesehelengNickelHo roala

Bophara Range

≤600mm (≤23.62inch)

Botenya Range

0.012~0.15mm (0.00047inches~0.0059inches)

Nickel Layer Botenya

≥0.4µm

≥0.2µm

Litaba tsa Nickel tsa Lera la Nickel

80 ~ 90% (E ka fetola litaba tsa nickel ho latela ts'ebetso ea welding ea bareki)

100% Nickel e hloekileng

Bokaholimo bo hanyetsanang le Lera la Nickel(Ω)

≤0.1

0.05~0.07

Ho khomarela

5B

Matla a tšepe

Base Material Attenuation ka mor'a Plating ≤10%

Elongation

Base Material Attenuation After Plating ≤6%

Tsoelo-pele ea rona e ipapisitse le lisebelisoa tse ntlafalitsoeng haholo, litalenta tse hloahloa le matla a mahlale a matlafatsoa khafetsa bakeng sa Fektheri e Rekisang China Electrolytic Copper Foil bakeng sa Battery Anode Substrate, phaello le menyaka ea Bareki e lula e le sepheo sa rona se seholo. O lokela ho iteanya le rona. Re fe monyetla, re u fe ntho e makatsang.
Factory SellingGn-Bccf, Re motlotlo ho fana ka lihlahisoa tsa rona ho moetsi e mong le e mong oa likoloi lefatšeng ka bophara ka lits'ebeletso tsa rona tse tenyetsehang, tse sebetsang ka potlako le maemo a thata a taolo a boleng ao esale a amoheloa le ho rorisoa ke bareki.


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