ED Copper Foils bakeng sa FPC
Kenyelletso ea Sehlahisoa
Electrolytic copper foil bakeng sa FPC e ntshetswa pele le ho etsetswa indasteri ya FPC (FCCL).Foil ena ea koporo e nang le electrolytic e na le ductility e betere, mahoashe a tlase le matla a betere a lekhapetla ho feta likhalase tse ling tsa koporo.Ka nako e ts'oanang, qetello ea bokaholimo le bokhabane ba foil ea koporo e molemo 'me ho hanyetsa ho phutha ho boetse ho molemo ho feta lihlahisoa tse tšoanang tsa koporo ea koporo.Kaha foil ena ea koporo e thehiloe ts'ebetsong ea electrolytic, ha e na mafura, e leng se etsang hore ho be bonolo ho kopanngoa le lisebelisoa tsa TPI ka mocheso o phahameng.
Dimension Range
Botenya: 9µm~35µm
Lits'ebetso
Sebaka sa sehlahisoa se ntšo kapa se khubelu, se na le mahoashe a tlaase.
Lisebelisoa
Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED e koahetsoeng ka filimi e tšesaane ea kristale.
Likaroloana
Boima bo phahameng, khanyetso e phahameng ea ho kobeha le ts'ebetso e ntle ea etching.
Microstructure
SEM (Pele ho Phekolo ea Bokaholimo)
SEM (Lehlakore le Benyang ka mor'a Phekolo)
SEM (Lehlakore le Lebe kamora Kalafo)
Table1- Tshebetso (GB/T5230-2000、IPC-4562-2000)
Karolelano | Yuniti | 9mm | 12μm | 18μm | 35μm | |
Cu Content | % | ≥99.8 | ||||
Boima ba Sebaka | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | |
Matla a tšepe | RT(23℃) | Kg/mm2 | ≥28 | |||
HT(180℃) | ≥15 | ≥15 | ≥15 | ≥18 | ||
Elongation | RT(23℃) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 |
HT(180℃) | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ||
Boqhobane | E benyang(Ra) | μm | ≤0.43 | |||
Matte(Rz) | ≤2.5 | |||||
Matla a Peel | RT(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.8 | ≥0.8 |
Sekhahla se theohileng sa HCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||
Ho fetoha ha 'mala(E-1.0hr/200℃) | % | E ntle | ||||
Solder e Phaphameng 290 ℃ | Karolo. | ≥20 | ||||
Ponahalo(Letheba le phofo ea koporo) | ---- | Ha ho letho | ||||
Pinhole | EA | Zero | ||||
Mamello ea Boholo | Bophara | mm | 0 ~ 2 limilimithara | |||
Bolelele | mm | ---- | ||||
Ea mantlha | Mm/inch | Ka hare Diameter 79mm/3 inch |
Hlokomela:1. Ts'ebetso ea koporo ea foil oxidation resistance le index density index li ka buisanoa.
2. Lenane la tšebetso le itšetlehile ka mokhoa oa rona oa teko.
3. Nako ea tiiso ea boleng ke matsatsi a 90 ho tloha letsatsing la ho fumana.