Seo re ka se Bolelang Fora ea Copper Fora ka Puisano ea 5G ka 5g haufinyane?

Ka har'a lisebelisoa tsa Bokamoso ba 5G, tšebeliso ea meruti ea koporo e tla hola hape, haholo-holo libakeng tse latelang:

1. Li-Pricy tse phahameng tsa Frecy-frecy (li-Boards tsa potoloho)

• Fora ea Copper e tlase: Ho potlaka ka lebelo le phahameng la puisano le ho baloa tlaase ho hloka mekhoa ea phetisetso e phahameng ea matšoao a boqapi ba board ea potoloho ea potoloho, ho beha boitšoaro bo phahameng le botsitso. Sefai sa Copper se tlase, se nang le maemo a boreleli, ho fokotsa tahlehelo ea ho hanyetsa ka lebaka la "phello ea letlalo" nakong ea ho fanoa ka bopaki ba matšoao, ho boloka botšepehi ba matšoao, ho boloka botšepehi ba matšoao Meporo ena ea koporo e tla sebelisoa hohle ka li-khopolo e phahameng ea likhalase tsa likonyana tsa 5G tsa 5G, haholo-holo tse sebetsang li-millentimber-le kaholimo ho 30ghz).
• Phahamisetso ea Copper e phahameng: Li-module tsa Antennas le RF tse sebelisang lisebelisoa tsa 5G li hloka lisebelisoa tse kholo ho ntlafatsa phetiso ea matšoao le ts'ebetso ea kamohelo. Ho ba le boitšoaro bo phahameng le pokello eafoil ea koporomake it an ideal choice for miniaturized, high-frequency antennas. Theknoloji ea li-milione, moo lienntena li nyane 'me li hloka ts'ebetso ea phetisetso e phahameng ea password, ultra-sopper.
• Mokhanni oa mokhanni oa mokhanni oa thepa: E Mehleng ea 5G, lisebelisoa tsa puisano li bontša ho ba bobebe, li fokola le ho feta, tse lebisang ho li-smartphones, lisebelisoa tse bohlale le li-furini tsa malapeng. Mefopo ea koporo, boitšoaro ba eona bo botle, boitšoaro ba eona bo botle, ho hana ho fokola ha bona, ke thepa ea bohlokoa.
• : HDI technology is vital for the miniaturization and high performance of 5G devices. HDI PCBs achieve higher circuit density and signal transmission rates through finer wires and smaller holes. Tloaelo ea fori ea komporo ea ultra-tšesaane ea koporo (e kang 9μm kapa e tšesaane) e thusa ho fokotsa boto, le ho ts'epahala, le ho ts'epahala, le ho fokotsa kotsi ea ho lets'oao. Such ultra-thin copper foil will be widely used in 5G smartphones, base stations, and routers.
• Litefiso tse phahameng tsa comalication tse phahameng tsa comalication: Lisebelisoa tsa 5g li hlahisa mocheso o moholo nakong ea ts'ebetso, haholo-holo ha o sebetsana le matšoao a khafetsa le likhakanyo tse kholo tsa data tse hlokang taolo e phahameng. Mefopo ea koporo, e nang le boitšoaro ba eona bo botle ba lisebelisoa tse futhumetseng tsa lisebelisoa tsa 5- ho isa mochesong, ho ntlafatsa moea le bophelo bo bolelele.
• Kopo ho li-module tsa LTCC: Ka har'a lisebelisoa tsa 5g, theknoloji ea LTCC e sebelisoa haholo ho li-module tsa RF kapele, lifilimi le libapali tsa antenna.Foil ea koporo, le ts'ebeliso ea eona e ntle ea boitšoaro, le ka boiketlo ba tšebetso, hangata e sebelisoa e le lisebelisoa tsa karolelano ea LTCC. Ho feta moo, foil ea Copper e ka koaheloa ka lisebelisoa tsa axidation ho ntlafatsa botsitso le ho ts'epahala nakong ea bojaneng ba LTCC.
• Frop foil bakeng sa lipotoloele tsa li-millimeter-waveFoil ea koporoe ka sebelisoa ho etsa liboto tsa potoloho le li-antenna litsamaiso tsa radar, li fana ka botšepehi bo hloahloa le botsi bo botle ba letšoao le ts'ebetso ea phetiso.

2. Miniature antenas le RF modules

3. Meea e hatisitsoeng e hatisitsoeng ea potoloho e hatisitsoeng (fpcs)

4.

5. Taolo ea motlakase

6. Mohlaseli oa mocheso o tlase oa tšepe (LTCC) theknoloji ea liphutheloana

7.

Overall, the application of copper foil in future 5G communication equipment will be broader and deeper. Ho tloha khafetsa ho fallisetsoa ho fallisoa ka mokhoa o phahameng oa ho etsa lintho tse phahameng tsa botoneng ho ea ho "Makhono a maholo le ho beha tšebetsong le ts'ebetso e sebetsang ea lisebelisoa tsa 5G.