Electrodeposited (ED)foil ea koporoke mokokotlo o sa bonahaleng oa lisebelisoa tsa elektroniki tsa sejoale-joale. Boemo ba eona bo bosesane haholo, ductility e phahameng, le conductivity e ntle haholo e etsa hore e be ea bohlokoa libeteri tsa lithium, li-PCB le lisebelisoa tsa elektroniki tse tenyetsehang. Ho fapana lefoil ea koporo e kentsoeng, e itšetlehileng ka deformation ea mechine,ED koporo foile hlahiswa ke electrochemical deposition, ho fihlela taolo ea boemo ba atomic le tloaelo ea ts'ebetso. Sengoliloeng sena se senola ho nepahala ha tlhahiso ea eona le hore na lits'ebetso tse ncha li fetola liindasteri joang.
I. Tlhahiso e Tloaelehileng: Ho nepahala ho Boenjiniere ba Electrochemical
1. Tokisetso ea Electrolyte: Foromo ea Nano-Optimized
Electrolyte ea motheo e na le sulfate ea koporo e hloekileng haholo (80–120g/L Cu²⁺) le sulfuric acid (80–150g/L H₂SO₄), e nang le gelatin le thiourea e kentsoeng maemong a ppm. Lisebelisoa tse tsoetseng pele tsa DCS li laola mocheso (45–55°C), sekhahla sa phallo (10–15 m³/h), le pH (0.8–1.5) ka nepo. Li-adsorb ho cathode ho tataisa sebopeho sa lijo-thollo tsa nano-level le ho thibela mefokolo.
2. Foil Deposition: Atomic Precision in Action
Ka liseleng tsa electrolytic tse nang le li-roll tsa cathode tsa titanium (Ra ≤ 0.1μm) le li-anode tsa alloy lead, 3000-5000 A/m² DC hona joale e khanna koporo ea ion deposition holim'a cathode holim'a (220) orientation. Botenya ba foil (6–70μm) bo hlophisoa hantle ka lebelo la roll (5-20 m/min) le liphetoho tsa hajoale, ho fihlela taolo ea botenya ba ± 3%. The thinnest foil e ka fihla 4μm—1/20th botenya ba moriri oa motho.
3. Ho Hlatsoa: Libaka tse Hloekileng Haholo ka Metsi a Hloekileng
Mothati oa 1 o sebelisa metsi a hloekileng (≤5μS/cm), Mothati oa 2 o sebelisa maqhubu a ultrasonic (40kHz) ho tlosa mesaletsa ea lintho tse phelang, 'me Mothati oa 3 o sebelisa moea o futhumetseng (80-100 ° C) bakeng sa ho omisa ntle le matheba. Sena se fella kafoil ea koporoka maemo a oksijene <100ppm le masala a sebabole a <0.5μg/cm².
4. Slitting le Packaging: Precision to the Final Micron
Mechini ea lebelo le holimo e nang le taolo ea laser e tiisang ho mamellana ha bophara ka har'a ± 0.05mm. Sephutheloana sa vacuum anti-oxidation se nang le matšoao a mongobo se boloka boleng ba bokaholimo nakong ea lipalangoang le polokelo.
II. Phekolo ea Bokaholimo: Ho notlolla Ts'ebetso e Khethehileng ea Indasteri
1. Litlhare tsa Roughening: Micro-Anchoring bakeng sa Bonding e Matlafalitsoeng
Kalafo ea Nodule:Pulse plating ka CuSO₄-H₂SO₄-As₂O₃ tharollo e etsa li-nodule tsa 2-5μm holim'a foil, e ntlafatsa matla a ho khomarela ho 1.8-2.5N / mm-e loketseng liboto tsa potoloho tsa 5G.
Dual Peak Roughening:Likaroloana tsa koporo tse nyane le nano-scale li eketsa bokaholimo ka 300%, li ntlafatsa ho khomarela ka har'a lithium battery anode ka 40%.
2. Mosebetsi oa Plating: Molecular-Scale Armor bakeng sa ho tšoarella
Ho roala Zinc/Tin:Lera la tšepe la 0.1–0.3μm le atolosa khanyetso ea spray ea letsoai ho tloha lihora tse 4 ho isa ho tse 240, e leng se etsang hore e be sebaka sa ho ea ho li-tab tsa betri tsa EV.
Seaparo sa Nickel-Cobalt Alloy:Li-Pulse-plated nano-grain layers (≤50nm) li fihlela boima ba HV350, li tšehetsa li-substrates tse kobehang bakeng sa li-smartphones tse phuthoang.
3. Ho hanyetsa Mocheso o Phahameng: Ho Pholoha ka ho Fetisisa
Sol-gel SiO₂-Al₂O₃ coatings (100–200nm) e thusa foil ho hanela oxidation ho 400 ° C (oxidation <1mg/cm²), e etsa hore e tsamaisane hantle le lisebelisoa tsa wiring tsa sefofane.
III. Ho Matlafatsa Meeli e Meraro e Meholo ea Liindasteri
1. Libetri tse Ncha tsa Matla
CIVEN METAL's 3.5μm foil (≥200MPa tensile, ≥3% elongation) e eketsa matla a betri a 18650 ka 15%. Foil e entsoeng ka mokhoa o tloaelehileng (30-50% porosity) e thusa ho thibela ho thehoa ha lithium dendrite ka libeteri tsa boemo bo tiileng.
2. Li-PCB tse tsoetseng pele
Foil ea boemo bo tlase (LP) e nang le Rz ≤1.5μm e fokotsa tahlehelo ea matšoao ho liboto tsa 5G millimeter-wave ka 20%. Ultra-low profile (VLP) foil e nang le reverse-treated finish (RTF) e tšehetsa litekanyetso tsa data tsa 100Gb/s.
3. Flexible Electronics
AnnealedED koporo foil(≥20% elongation) e entsoeng ka laminated ka lifilimi tsa PI e mamella ho kobeha ho feta 200,000 (1mm radius), e sebetsa e le "skeleton e tenyetsehang" ea lintho tse ka roaloang.
IV. CIVEN METAL: Moetapele oa Boiketlo ho ED Copper Foil
Joalo ka ntlo ea matla e khutsitseng ho foil ea koporo ea ED,CIVEN TŠEPEe hahile sistimi e tsoetseng pele, e tloaelehileng ea tlhahiso:
Nano-Additive Library:Metsoako e fetang 200 ea tlatsetso e etselitsoeng matla a holimo, bolelele le botsitso ba mocheso.
Tlhahiso ea Foil e Tataisoang ke AI:AI-optimized parameters netefatsa ± 1.5% botenya bo nepahetseng le ≤2I flatness.
Sebaka sa Kalafo ea Bokaholimo:Mehala e 12 e inehetseng e fanang ka likhetho tse 20+ tseo u ka li khethang (ho roala, ho roala, ho roala).
Litšenyehelo tse ncha:Ho khutlisa litšila ka har'a marang-rang ho eketsa tšebeliso ea koporo e tala ho 99.8%, ho fokotsa litšenyehelo tsa tloaelo tsa foil ka 10-15% ka tlase ho karolelano ea 'maraka.
Ho tloha taolong ea lebone la athomo ho isa ho tokiso ea ts'ebetso e kholo,ED koporo foile emela mehla e mecha ea boenjiniere ba lintho tse bonahalang. Ha phetoho ea lefats'e ea ho kenya motlakase le lisebelisoa tse bohlale e ntse e eketseha,CIVEN TŠEPEe etella pele tefiso ka mokhoa oa eona oa "atomic precision + application innovation"-e sutumelletsang tlhahiso e tsoetseng pele ea Chaena ho ea holimo ho ketane ea boleng ea lefatše.
Nako ea poso: Jun-03-2025