Ka tsoelo-pele e potlakileng ea theknoloji, lihlahisoa tsa elektroniki e fetohile karolo ea bohlokoa ea bophelo ba letsatsi le letsatsi ea batho. Chips, as the “heart” of electronic devices, every step in their manufacturing process is crucial, and copper foil plays a pivotal role throughout the semiconductor manufacturing industry. With its outstanding electrical conductivity and thermal conductivity, copper foil has a wide range of applications and important functions.
Foil ea koporoke e 'ngoe ea thepa e ka sehloohong e sebelisitsoeng tlhahisong ea liboto tse hatisitsoeng tsa potoloho (li-PCB), e leng karolo ea ho hokahanya lichifi ka likarolo tse ling tsa elektroniki. Ketsong ena, foil ea koporo e kenelletse ka mokhoa o ikhethileng ho theha mekhoa e metle ea phepelo e ntle, e sebetsang ho phetisetso ea phetisetso ea letšoao le matla. Ha a etsa tlhahiso ea semiconductor
The generation of heat during chip operation is inevitable. With its excellent thermal conductivity, copper foil plays an important role in heat management. E tsamaisa ka botlalo mocheso o hlahisoang ke Chip, o fokotsa moroalo oa chip, kahoo o e sireletsa a le kotsing e jang le ho nka nako e telele.
foil ea koporois used to connect the tiny components inside the chip and establish connections with the outside world. Khokahano ena ha e hloke feela boitšoaro bo botle ba motlakase empa e boetse e le matla a lekaneng le ho tšepahala, litlhokahalo tseo Copper e lekanang hantle. It ensures that electronic signals can flow freely and accurately within and outside the chip.
Ha a le har'a mahlale a ntseng a hlahisa a le 5g le a le holimo ka ho fetisisa, foil ea koporo e bohlokoa ka ho khetheha ka lebaka la bokhoni ba eona ba ho boloka lintho tse ngata bophelong bo phahameng. Li-letšoao le phahameng li beha lintho tse ngata ho sebelisoa ka boitšoaro le botsitso ba thepa ea koporo, e e etsa lihlahisoa tsa bohlokoa tsa ho fana ka mokhoa o phahameng.
Lehafoil ea koporoE bapala karolo ea bohlokoa ho la Chip, joalo ka ha Chip theknoloji ea chip e ntse e tsoela pele ho li-miniaturization le tšebetso e phahameng, litlhokahalo tsa foil tsa Copper. Botenya, bohloeki, bohloeki, bohloeki, bohloeki, le botsitso ba ts'ebetso ea bona tlasa maemo a ona a feteletseng ke mathata ohle a etsang tlhahlobo eo bahlahisi ba hlokang ho e hlola.
Ha re sheba pele, ka nts'etsopele ea lisebelisoa le lits'ebetso tse ncha, ts'ebeliso ea foil ea koporo ho indasteri ea semiconductor e tla holisoa le ho teba. Hore na ke ts'ebetso ea chip ea chip ea chip e ntlafatsang, kapa e kopana le litlhoko tsa khafetsa, ka ho ts'ehetsa tsoelo-pele e sa lefelloeng le nts'etsopele ea iphone ea semiconductor
Nako ea poso: Mar-28-2024