Kalafo ea Ka mor'a Phekolo ea Koporo: "Anchor Lock" Theknoloji ea Sehokelo le Tlhahlobo e Felletseng ea Kopo.

Tšimong eafoil ea koporotlhahiso, roughening ka mor'a kalafo ke tshebetso senotlolo sa ho notlolla segokanyimmediamentsi sa sebolokigolo bonding matla. Sengoliloeng sena se sekaseka tlhokahalo ea kalafo e thata ho tsoa ho litebello tse tharo: ts'ebetso ea anchoring ea mochini, mekhoa ea ts'ebetso ea ts'ebetso, le ho ikamahanya le maemo a ho qetela. E boetse e hlahloba boleng ba ts'ebeliso ea theknoloji ena masimong a kang puisano ea 5G le libeteri tse ncha tsa matla, tse thehiloeng hoCIVEN TŠEPE's tsoelo-pele ea tekheniki.

1. Kalafo ea ho Roughening: Ho tloha ho "Smooth Trap" ho ea ho "Anchored Interface"

1.1 Liphoso Tse Bolaeang tsa Sebaka se Boreleli

The original roughness (Ra) eafoil ea koporobokaholimo hangata bo ka tlase ho 0.3μm, e lebisang litabeng tse latelang ka lebaka la litšobotsi tsa eona tse kang seipone:

• Tlamahano e sa lekaneng ea 'Mele: Sebaka sa ho kopana le resin ke 60-70% feela ea boleng ba theory.
• Lik'hemik'hale Tsa Bonding: Lera le letenya la oxide (Cu₂O botenya bo ka bang 3-5nm) le sitisa ho pepeseha ha lihlopha tse sebetsang.
• Thermal Stress Sensitivity: Phapang ea CTE (Coefficient of Thermal Expansion) e ka baka delamination ea interface (ΔCTE = 12ppm / ° C).

1.2 Liphetoho tse Tharo tsa Bohlokoa tsa Tekheniki Mekhoeng ea ho Roughening

Ka ho theha sebopeho sa likarolo tse tharo tsa boemo ba micron (bona setšoantšo sa 1), lera le thata le fihlella:

• Mechanical Interlocking: Resin ho kenella ka mefuta ea "barbed" anchoring (botebo> 5μm).
• Tšebeliso ea Lik'hemik'hale: Ho pepesa (111) lifofane tsa kristale tse sebetsang hantle ho eketsa bongata ba sebaka sa marang-rang ho 10⁵ libaka/μm².
• Thermal Stress Buffering: Sebopeho sa porous se monya ho feta 60% ea khatello ea mocheso.
• Tsela ea Ts'ebetso: Tharollo e nang le asiti ea koporo (CuSO₄ 80g/L, H₂SO₄ 100g/L) + Pulse Electro-deposition (mosebetsi cycle 30%, frequency 100Hz)
• Likarolo tsa Sebopeho:
  • Bophahamo ba dendrite ea koporo ke 1.2-1.8μm, bophara ba 0.5-1.2μm.
  • Likahare tsa oksijene ea holim'a metsi ≤200ppm (tlhahlobo ea XPS).
  • Khokahano ea ho kopana <0.8mΩ·cm².
• Tsela ea Ts'ebetso: Tharollo ea motsoako oa cobalt-nickel (Co²+ 15g/L, Ni²+ 10g/L) + Chemical Displacement Reaction (pH 2.5-3.0)
• Likarolo tsa Sebopeho:
  • CoNi alloy particle size 0.3-0.8μm, stacking density > 8×10⁴ particles/mm².
  • Likahare tsa oksijene ka holim'a metsi ≤150ppm.
  • Ho hanyetsa ho kopana <0.5mΩ·cm².

2. Red Oxidation vs. Black Oxidation: The Process Secrets Ka mor'a Mebala

2.1 Red Oxidation: "Lihlomo" tsa Koporo

2.2 Black Oxidation: The Alloy "Lihlomo"

2.3 Monahano oa Khoebo ka Mora ho Khetho ea Mebala

Leha matšoao a bohlokoa a ts'ebetso (ho khomarela le ho tsamaisa) a oxidation e khubelu le e ntšo e fapana ka tlase ho 10%, 'maraka o bonts'a phapang e hlakileng:

• Lesela le Lefubelu le Oxidized Koporo: E ikarabella bakeng sa 60% ea karolo ea 'maraka ka lebaka la melemo ea eona e kholo ea litšenyehelo (12 CNY/m² vs. black 18 CNY/m²).
• Lesela le Letšo la Koporo le Oxidized: E laola 'maraka oa maemo a holimo (FPC e kentsoeng koloing, li-PCB tsa millimeter-wave) ka karolo ea 75% ea mmaraka ka lebaka la:
  • Phokotso ea 15% ea tahlehelo e phahameng ea maqhubu (Df = 0.008 vs. red oxidation 0.0095 ho 10GHz).
  • 30% e ntlafalitse khanyetso ea CAF (Conductive Anodic Filament).

3. CIVEN TŠEPE: "Nano-Level Masters" ea Roughening Technology

3.1 Theknoloji e ncha ea "Gradient Roughening".

Ka taolo ea mehato e meraro,CIVEN TŠEPEe ntlafatsa sebopeho sa bokaholimo (sheba setšoantšo sa 2):

1. Lera la Peo la Nano-Crystalline: Electro-deposition ea cores cores 5-10nm ka boholo, density> 1×10¹¹ likaroloana/cm².
2. Khōlo ea Micron Dendrite: Pulse ea hona joale e laola mokhoa oa dendrite (ho etelletsa pele tataiso ea (110)).
3. Sebaka sa Phahamiso: Organic silane coupling agent (APTES) e ntlafatsa khanyetso ea oxidation.

3.2 Ts'ebetso e Fetang Maemo a Indasteri

3.3 Qetellong ea ho Sebelisa Matrix ea Likopo

• 5G Base Station PCB: E sebelisa foil e ntšo ea koporo e entsoeng ka oxidized (Ra = 1.5μm) ho finyella <0.15dB / cm tahlehelo ea ho kenya 28GHz.
• Babokelli ba Battery ba Matla: E khubelu e nang le oxidizedfoil ea koporo(tekanyetso ea matla 380MPa) e fana ka bophelo ba potoloho> 2000 cycles (tekanyetso ea naha 1500 cycles).
• Li-FPC tsa Aerospace: Lera le mahoashe le mamella mocheso oa mocheso ho tloha ho -196 ° C ho ea ho +200 ° C bakeng sa lipotoloho tse 100 ntle le delamination.

4. Lebala la Ntoa ea Bokamoso bakeng sa Foil ea Koporo e Khōlō

4.1 Theknoloji ea Ultra-Roughening

Bakeng sa litlhoko tsa puisano tsa 6G terahertz, ho ntse ho ntlafatsoa sebopeho sa serrated se nang le Ra = 3-5μm:

• Dielectric Constant Stability: E ntlafalitse ho ΔDk <0.01 (1-100GHz).
• Thermal Resistance: E fokotsehile ka 40% (ho fihlela 15W/m·K).

4.2 Litsamaiso tsa Smart Roughening

Tlhahlobo ea pono e kopaneng ea AI + phetoho e matla ea ts'ebetso:

• Tlhokomelo ea Nako ea 'Nete ea Sebaka: Sampling frequency 100 liforeimi motsotsoana.
• Adaptive Current Density Adjustment: Ho nepahala ±0.5A/dm².

Phekolo ea koporo e hlabang ka mor'a kalafo e fetohile ho tloha "mokhoeng oa boikhethelo" ho ea ho "katiso ea ts'ebetso." Ka boqapi ba ts'ebetso le taolo e feteletseng ea boleng,CIVEN TŠEPEe sutumelitse theknoloji e thata ho ea boemong bo nepahetseng ba boemo ba athomo, e fana ka tšehetso ea motheo bakeng sa ntlafatso ea indasteri ea lisebelisoa tsa elektroniki. Nakong e tlang, peisong ea theknoloji e bohlale, e phahameng, le e ka tšeptjoang ho feta, mang kapa mang ea tsebang "khoutu ea "micro-level" ea thekenoloji e matla o tla laola boemo bo phahameng ba leano.foil ea koporoindasteri.

(Mohloli oa Lintlha:CIVEN TŠEPETlaleho ea Selemo ea 2023 ea Theknoloji, IPC-4562A-2020, IEC 61249-2-21)