Passivation ke ts'ebetso ea mantlha tlhahisong ea rolledfoil ea koporo. E sebetsa e le "thebe ea boemo ba limolek'hule" holim'a metsi, e matlafatsa khanyetso ea kutu ha e ntse e leka-lekanya phello ea eona ho thepa ea bohlokoa joaloka conductivity le solderability. Sengoliloeng sena se shebisisa mahlale a morao-rao a mekhoa ea passivation, khoebo ea tšebetso, le mekhoa ea boenjiniere. Ho sebelisaCIVEN TŠEPEKa mohlala, re tla hlahloba boleng ba eona bo ikhethang tlhahisong ea maemo a holimo ea lisebelisoa tsa elektroniki.
1. Passivation: "Molecular-Level Shield" bakeng sa Foil ea Koporo
1.1 Mokhoa oa Lera la Passivation le Etsahalang
Ka phekolo ea lik'hemik'hale kapa tsa electrochemical, compact oxide layer 10-50nm e teteaneng ka holim'afoil ea koporo. E entsoe haholo ka Cu₂O, CuO, le li-organic complexes, karolo ena e fana ka:
- Litšitiso tsa 'Meleng:Coefficient ea phano ea oksijene e theohela ho 1×10⁻¹⁴ cm²/s (ho theoha ho tloha ho 5×10⁻⁸ cm²/s bakeng sa koporo e se nang letho).
- Electrochemical Passivation:Tekanyetso ea hona joale ea kutu e theoha ho tloha ho 10μA/cm² ho ea ho 0.1μA/cm².
- Inertness ea lik'hemik'hale:Matla a mahala a holim'a metsi a fokotsehile ho tloha ho 72mJ/m² ho ea ho 35mJ/m², e leng se hatellang boitšoaro bo sebetsang.
1.2 Melemo e Mehlano ea Bohlokoa ea ho Fella
| Karolo ea Ts'ebetso | Foil ea Koporo e sa Alaoeng | Passivated Copper Foil | Ntlafatso |
| Teko ea Spray ea Letsoai (lihora) | 24 (libaka tse bonahalang tsa mafome) | 500 (ha ho na kutu e bonahalang) | + 1983% |
| Oxidation ea Mocheso o Phahameng (150°C) | Lihora tse 2 (e fetoha e ntšo) | Lihora tse 48 (li boloka 'mala) | + 2300% |
| Bophelo ba Polokelo | Likhoeli tse 3 (e tletse ka moea o hloekileng) | Likhoeli tse 18 (tse tloaelehileng li pakiloe) | + 500% |
| Contact Resistance (mΩ) | 0.25 | 0.26 (+4%) | - |
| Tahlehelo ea ho Kena ha Maqhubu a Phahameng (10GHz) | 0.15dB/cm | 0.16dB/cm (+6.7%) | - |
2. “Sabole e Mohaleng Habeli” ea Likarolo tsa Passivation—le Mokhoa oa ho E Leka-leka-lekanya
2.1 Ho Lekola Likotsi
- Phokotso e Nyane ea Boitšoaro:Sebaka sa passivation se eketsa botebo ba letlalo (ho 10GHz) ho tloha ho 0.66μm ho ea ho 0.72μm, empa ka ho boloka botenya bo ka tlase ho 30nm, ho eketseha ha matla ho ka fokotsoa ho tlase ho 5%.
- Mathata a Soldering:Matla a tlase a eketsa li-angles tsa solder wetting ho tloha 15° ho ea ho 25°. Ho sebelisa li-pastes tse sebetsang tsa solder (mofuta oa RA) ho ka fokotsa phello ena.
- Mathata a Adhesion:Matla a tlamahano ea resin a ka theoha ka 10-15%, e ka fokotsoang ka ho kopanya mekhoa e thata le ea passivation.
2.2CIVEN TŠEPEMokhoa oa ho leka-lekanya
Theknoloji ea Gradient Passivation:
- Lera la Motheo:Khōlo ea electrochemical ea 5nm Cu₂O e nang le (111) mokhoa o ratoang.
- Lera la Mahareng:Filimi e ipokelletseng ea 2–3nm benzotriazole (BTA).
- Lera le ka Ntle:Silane coupling agent (APTES) ho matlafatsa ho khomarela resin.
Liphetho tse ntlafalitsoeng tsa ts'ebetso:
| Metric | IPC-4562 Litlhoko | CIVEN TŠEPELiphetho tsa Copper Foil |
| Ho hanyetsana le Bokaholimo (mΩ/sq) | ≤300 | 220–250 |
| Matla a Peel (N/cm) | ≥0.8 | 1.2–1.5 |
| Solder Joint Tensile Strength (MPa) | ≥25 | 28–32 |
| Sekhahla sa Phallo ea Ionic (μg/cm²) | ≤0.5 | 0.2–0.3 |
3. CIVEN TŠEPETheknoloji ea Passivation: Ho Hlalosa bocha Melao ea Tšireletso
3.1 Mokhoa oa Tšireletso oa Mekhahlelo e Mene
- Taolo ea Oksijene e Thin:Pulse anodization e fihlella phapang ea botenya ka har'a ± 2nm.
- Lihlopha tsa Organic-Inorganic Hybrid:BTA le silane li sebetsa 'moho ho fokotsa sekhahla sa kutu ho isa ho 0.003mm/selemo.
- Kalafo ea Tšebeliso ea Bokaholimo:Ho hloekisa plasma (motsoako oa khase ea Ar/O₂) ho khutlisetsa li-angles tsa solder wetting ho 18°.
- Tlhokomelo ea Nako ea 'Nete:Ellipsometry e netefatsa botenya ba sekhahla sa passivation ka har'a ± 0.5nm.
3.2 Tiiso e Felletseng ea Tikoloho
- Mongobo o Phahameng le Mocheso:Kamora lihora tse 1,000 ho 85 ° C / 85% RH, ho hanyetsa holimo ho fetoha ka tlase ho 3%.
- Thermal Shock:Ka mor'a lipotoloho tse 200 tsa -55 ° C ho + 125 ° C, ha ho mapetsong a hlahang karolong ea passivation (e tiisitsoe ke SEM).
- Ho hanyetsa Lik'hemik'hale:Ho hanana le 10% mouoane oa HCl o eketseha ho tloha metsotsong e 5 ho isa ho metsotso e 30.
3.3 Tšebelisano ho Likopo
- 5G Millimeter-Wave Antennas:Tahlehelo ea ho kenya 28GHz e fokotsehile ho 0.17dB/cm feela (ha e bapisoa le 0.21dB/cm ea bahlolisani).
- Motlakase oa Likoloi:E fetisa liteko tsa ISO 16750-4 tsa setlolo sa letsoai, ka li-cycle tse atolositsoeng ho isa ho 100.
- IC Substrates:Matla a ho khomarela ka ABF resin a fihla ho 1.8N / cm (karolelano ea indasteri: 1.2N / cm).
4. Bokamoso ba Theknoloji ea Passivation
4.1 Theknoloji ea ho Beha Lera la Atomic (ALD).
Ho nts'etsapele lifilimi tsa nanolaminate passivation tse thehiloeng ho Al₂O₃/TiO₂:
- Botenya:<5nm, ka resistivity eketseha ≤1%.
- CAF (Conductive Anodic Filament) Resistance:5x ntlafatso.
4.2 Mekhahlelo ea Boipheliso ea Boipheliso
Ho kenyelletsa li-microcapsule corrosion inhibitors (li-benzimidazole derivatives):
- Boipheliso ba ho Ipholisa:Ho feta 90% nakong ea lihora tse 24 ka mor'a mengoapo.
- Bophelo ba Tšebeletso:E atolositsoe ho lilemo tse 20 (ha e bapisoa le lilemo tse 10-15).
Qetello:
Phekolo ea Passivation e fihlella ho leka-lekana ho hloekisitsoeng pakeng tsa ts'ireletso le ts'ebetso bakeng sa rolledfoil ea koporo. Ka boqapi,CIVEN TŠEPEe fokotsa maemo a tlase a passivation, a e fetola "sehlomo se sa bonahaleng" se matlafatsang ts'epehi ea sehlahisoa. Ha indasteri ea lisebelisoa tsa elektroniki e ntse e tsoela pele ho ts'epahala le ho ts'epahala, mokhoa o nepahetseng le o laoloang e se e le motheo oa ho etsa lifolakha tsa koporo.
Nako ea poso: Mar-03-2025