Ho roala thini ho fana ka "lihlomo tse tiileng tsa tšepe" bakeng safoil ea koporo, ho leka-lekanya ho leka-lekana pakeng tsa solderability, corrosion resistance, le theko e tlaase. Sengoliloeng sena se hlalosa kamoo foil ea koporo e entsoeng ka tin e fetohileng thepa ea mantlha bakeng sa lisebelisoa tsa elektroniki tsa bareki le tsa likoloi. E totobatsa mekhoa ea bohlokoa ea tlamahano ea athomo, lits'ebetso tse ncha, le lits'ebetso tsa ts'ebeliso ea ho qetela, ha e ntse e hlahloba.CIVEN TŠEPEtsoelo-pele ea theknoloji ea tin plating.
1. Melemo e meraro ea Bohlokoa ea ho Plating ka Tin
1.1 Ho tlola ha Quantum ts'ebetsong ea Soldering
Lesela la thini (le ka bang 2.0μm botenya) le fetola ho soasoa ka mekhoa e mengata:
- Ho Soldering ka Mocheso o Tlase: Lesenke le qhibiliha ho 231.9°C, ho fokotsa mocheso oa khoporo ho tloha ho 850°C ho ea ho 250–300°C feela.
- Ho Wetting e Ntlafetseng: Tin's tension ea holim'a metsi e theoha ho tloha ho 1.3N/m ea koporo ho ea ho 0.5N/m, ho eketsa sebaka sa ho jala sa solder ka 80%.
- Optimized IMCs (Intermetallic Compounds): Cu₆Sn₅/Cu₃Sn gradient layer e eketsa matla a ho kuta ho 45MPa (ho soasoa ka koporo e se nang letho ho fihlela 28MPa feela).
1.2 Corrosion Resistance: "Dynamic Barrier"
| Corrosion Scenario | Bare Copper Failure Nako | Nako ea ho hloleha ha Koporo ea Tin-Plated | Ntho ea Tšireletso |
| Sepakapaka sa indasteri | Likhoeli tse 6 (mafome a matala) | Lilemo tse 5 (ho lahleheloa ke boima ba 'mele <2%) | 10x |
| Mofufutso Corrosion (pH=5) | 72 lihora (perforation) | Lihora tsa 1,500 (ha ho na tšenyo) | 20x |
| Hydrogen Sulfidi Corrosion | Lihora tse 48 (tse ntšo) | Lihora tse 800 (ha ho na mebala) | 16x |
1.3 Ts'ebetso: Leano la "Micro-Sacrifice".
- Ho hanyetsa motlakase ho eketseha hanyenyane feela, ka 12% (1.72×10⁻⁸ ho 1.93×10⁻⁸ Ω·m).
- Matla a letlalo a ntlafala: Ho 10GHz, botebo ba letlalo bo eketseha ho tloha ho 0.66μm ho ea ho 0.72μm, e leng se bakang tahlehelo ea ho kenngoa ha 0.02dB / cm feela.
2. Mathata a ho sebetsa: "Cutting vs. Plating"
2.1 Ho Rala ka ho Felletseng (Ho Seha Pele ho Plating)
- Melemo: Lithako li koahetsoe ka botlalo, ha ho na koporo e pepesitsoeng.
- Mathata a Tekheniki:
- Burrs e tlameha ho laoloa ka tlase ho 5μm (mekhoa ea setso e feta 15μm).
- Tharollo ea plating e tlameha ho kenella ho feta 50μm ho netefatsa tšireletso e tšoanang.
2.2 Ho Plating ka Morao ho Seha (Ho Plating Pele ho Seha)
- Litšenyehelo Melemo: E eketsa katleho ea ts'ebetso ka 30%.
- Mathata a Bohlokoa:
- Metse ea koporo e pepesitsoeng e tloha ho 100–200μm.
- Bophelo ba ho fafatsa letsoai bo fokotsehile ka 40% (ho tloha ho lihora tse 2,000 ho isa ho lihora tse 1,200).
2.3CIVEN TŠEPEMokhoa oa "Zero-Defect".
Ho kopanya ho seha ka mokhoa o nepahetseng oa laser le pulse tin plating:
- Ho Seha ho Nepaha: Li-Burrs li bolokiloe ka tlase ho 2μm (Ra=0.1μm).
- Edge Coverage: Side plating botenya ≥0.3μm.
- Litšenyehelo-Ka katleho: Litšenyehelo tsa 18% li tlase ho feta mekhoa e tloaelehileng ea ho pola.
3. CIVEN TŠEPESekoti-PlatedFoil ea Koporo: Lenyalo la Saense le Aesthetics
3.1 Taolo e Nepahetseng ea Coating Morphology
| Mofuta | Mekhoa ea Ts'ebetso | Lintlha tsa Bohlokoa |
| Tin E Khanyang | Boima ba hajoale: 2A/dm², kenyelletso ea A-2036 | Reflectivity >85%, Ra=0.05μm |
| Matte Tin | Boima ba hajoale: 0.8A/dm², ha ho li-additives | Reflectivity <30%, Ra=0.8μm |
3.2 Melemo ea Ts'ebetso e Phahameng
| Metric | Kakaretso ea indasteri |CIVEN TŠEPEKoporo ea Tin-Plated | Ntlafatso |
| Coating Thickness Deviation (%) | ±20 | ±5 | -75% |
| Sekhahla sa Solder Void (%) | 8–12 | ≤3 | -67% |
| Bend Resistance (lipotoloho) | 500 (R=1mm) | 1,500 | + 200% |
| Khōlo ea Tin Whisker (μm/1,000h) | 10–15 | ≤2 | -80% |
3.3 Libaka tsa Kopo tsa Bohlokoa
- Li-FPC tsa li-smartphone: Matte tin (botenya 0.8μm) etsa bonnete ba soldering tsitsitseng bakeng sa 30μm mola / sebaka.
- Likoloi tsa ECUs: Lesenke le khanyang le mamella lipotoloho tse 3,000 tsa mocheso (-40 ° C↔+125 ° C) ntle le ho hloleha ha manonyeletso a solder.
- Photovoltaic Junction Mabokose: Ho roala ka mahlakoreng a mabeli (1.2μm) ho finyella khanyetso ea ho ikopanya <0.5mΩ, ho matlafatsa katleho ka 0.3%.
4. Bokamoso ba Tin Plating
4.1 Nano-Composite Coatings
Ho hlahisa liphahlo tsa Sn-Bi-Ag ternary alloy:
- Sebaka se tlase sa ho qhibiliha ho 138 ° C (se loketseng lisebelisoa tsa elektronike tse feto-fetohang tsa mocheso o tlase).
- E ntlafatsa khanyetso ea creep ka 3x (lihora tse fetang 10,000 ho 125 ° C).
4.2 Phetohelo ea ho Plating Tin e Tala
- Litharollo tsa Mahala tsa Cyanide: E fokotsa COD ea metsi a litšila ho tloha ho 5,000mg/L ho ea ho 50mg/L.
- Sekhahla se Phahameng sa Pholiso ea Tin: Ho feta 99.9%, ho fokotsa litšenyehelo ka 25%.
Lisebelisoa tsa tin li fetohafoil ea koporoho tloha ho conductor ea mantlha ho ea ho "intelligent interface material."CIVEN TŠEPETaolo ea ts'ebetso ea boemo ba athomo e sutumelletsa ho ts'epahala le ho tiea ha tikoloho ea foil ea koporo e kentsoeng ka tin ho fihla bophahamong bo bocha. Ha lisebelisoa tsa elektronike tsa bareki li ntse li fokotseha 'me lisebelisoa tsa elektroniki tsa likoloi li hloka ho ts'epahala haholo,foil ea koporo e entsoeng ka thinie fetoha motheo oa phetoho ea khokahanyo.
Nako ea poso: May-14-2025