Copper Foil Nickel Plating: Ho aha "Lihlomo tsa Nano-Level" le Kopanyo ea Mesebetsi e Mengata ea Bopula-maliboho

Nickel plating ke ts'ebetso ea bohlokoa ea phetoho e sebetsang e etsang hore ho be le lera le hlophisitsoeng hantle le thehiloeng ho nickel, le nolofalletsang.foil ea koporoho boloka botsitso bo ikgethang tlasa maemo a feteletseng. Sengoliloeng sena se hlahloba likhatelopele honickel-plated koporo foilthekenoloji e tsoang likhutlong tse tharo - ts'ireletso ea mocheso le kutu, tšireletso ea motlakase, le ts'ebetso e ncha. Ho sebelisaCIVEN TŠEPE's nano-scale nickel plating technology e le mohlala, e totobatsa boleng ba thepa mafapheng a tsoetseng pele joalo ka matla a macha le sefofane.

1. Mekhoa ea Tšireletso e 'Meli ea Tšireletso le Ts'ebetso ea Ts'ebetso ea Nickel Plating

1.1 Mekhoa ea 'Mele le ea Lik'hemik'hale bakeng sa Tšireletso ea Mocheso o Phahameng
Nickel layer (0.1μm thick) e fana ka tšireletso e phahameng ea mocheso o phahameng ka:

• Thermal Stability:Nickel e na le ntlha e qhibilihisang ea 1455°C (ha e bapisoa le 1085°C ea koporo). Ka 200–400°C, sekhahla sa eona sa oxidation ke 1/10 feela ea koporo (0.02mg/cm²·h vs. 0.2mg/cm²·h).
• Sethibelo sa Phatlalatso:E hatella ho falla ha athomo ea koporo holimo, ho fokotsa coefficient ea phano ho tloha ho 10⁻¹⁴ ho isa ho 10⁻¹⁸ cm²/s.
• Stress Buffering:Ka coefficient ea katoloso ea mocheso ea 13.4ppm/°C (ha e bapisoa le koporo ea 17ppm/°C), e fokotsa khatello ea mocheso ka 40%.

1.2 Khanyetso ea Corrosion e nang le "Tshreeketso e Meholo e meraro".

2. "Molao oa Khauta" oa 0.1μm Coating
2.1 Motheo oa Saense oa ho Ntlafatsa Botenya
Lipapiso tse felletseng le lintlha tsa liteko li tiisa hore 0.1μm nickel layer e fana ka tekanyo e nepahetseng:

• Conductivity:Ho hanyetsa ho eketseha ka 8% feela (ho tloha ho 0.017Ω·mm²/m ho isa ho 0.0184Ω·mm²/m).
• Ts'ebetso ea Mechini:Matla a matla a nyolohela ho 450MPa (ho tloha 350MPa bakeng sa koporo e se nang letho), le bolelele bo setseng ka holimo ho 15%.
• Taolo ea Litšenyehelo:Tšebeliso ea Nickel e fokotsehile ka 90% ha e bapisoa le liaparo tsa setso tsa 1μm, e fokotsa litšenyehelo ka 25 CNY/m².

2.2 Phello ea "Invisible Shield" ea Tšireletso ea Motlakase
Botenya ba nickel layer bo tsamaisana ka mokhoa o hlakileng le ts'ebetso ea tšireletso (SE):
SE(dB) = 20 + 50·log₁₀(t/0.1μm)
Ho t = 0.1μm, SE = 20dB.
Ka maqhubu a 1GHz:

• Tšireletso ea Tšimo ea Motlakase:>35dB (e thibela mahlaseli a 99.97%).
• Tšireletso ea Tšimo ea Magnetic:>28dB (e kopana le MIL-STD-461G).

3. CIVEN TŠEPE: Litsebi tsa Nano-Precision Nickel Plating
3.1 Lintlafatso tsa Tekheniki ho Electroplating
CIVEN TŠEPEe sebelisa mekhoa ea pulse electroplating le nano-additive composite:

• Litekanyetso tsa Pulse:Boima ba hona joale ba 3A/dm² (80% ea potoloho ea mosebetsi), morao-rao oa 0.5A/dm² (20% ea potoloho ea mosebetsi).
• Taolo ea Nano-Precision:E kenyelletsa peo ea nickel ea 2nm (botenya >10¹² likaroloana/cm²), ho fihlela boholo ba lijo-thollo ≤20nm.
• Botenya bo tšoanang:Coefficient of variation (CV) <3% (karolelano ea indasteri> 8%).

3.2 Melemo ea Ts'ebetso e Phahameng

3.3 Tailored Coating Solutions

• Seaparo sa Nickel se Lehlakoreng le le Leng:Botenya ba 0.08–0.12μm, bo loketse lipotoloho tse hatisitsoeng tse feto-fetohang (FPC).
• Melaetsa ea Nickel e Mahlakoreng a mabeli:Botenya ba 0.1μm ± 0.02μm, bo sebelisoang ho likoleke tsa hona joale tsa betri.
• Ho roala ha Gradient:0.1μm nickel holim 'a metsi + 0.05μm cobalt phetoho lera, bakeng sa aerospace-level mogote tsikitlanya ho hanyetsa.

4. Qetello ea Tšebeliso ea Likopo tsaLesela la Koporo le nang le Nickel-Plated

4.1 Libetri tse Ncha tsa Matla

• Libetri tsa Matla:Likarolo tsa Nickel li thibela kholo ea lithium dendrite, ho lelefatsa bophelo ba potoloho ho> 2,000 cycles (koporo e se nang letho: 1,200 cycles).
• Libetri tsa Naha tse Tiileng:Ho lumellana ho matlafalitsoeng le li-electrolyte tsa sulfide, ho hanyetsa sefahleho <5Ω·cm² (koporo e se nang letho > 20Ω·cm²).

4.2 Lisebelisoa tsa Elektronike tsa Sepakapaka

• Likarolo tsa Satellite RF:Ts'ireletso ea motlakase ea motlakase>30dB (Ka band), tahlehelo ea ho kenya <0.1dB/cm.
• Li-Sensors tsa Enjine:E mamella 800°C ea nako e khuts'oane ea ho tsukutloa ha mocheso e se nang delamination (SEM e netefalitsoe).

4.3 Thepa ea Boenjiniere ba Marine

• Lihokelo tsa Deep-Sea Submersible:E fetisa liteko tsa khatello ea botebo ba limithara tse 3,000 (30MPa), khanyetso ea kutu khahlanong le Cl⁻> lilemo tse 10.
• Lihokelo tsa Matla a Moea a Offshore:Bophelo ba ho fafatsa letsoai ho feta lihora tse 5,000 (IEC 61701-6 standard).

5. Bokamoso ba Nickel Plating Technology

5.1 Mekhabiso e Kopanetsoeng ea Atomic Layer Deposition (ALD).
Ho theha Ni/Al₂O₃ nano-laminates:

• Boemo ba Mocheso:Ho feta 600°C (setšoantšo sa nickel plating: 400°C).
• Corrosion Resistance:Ntlafatso ea 5x (bophelo ba ho fafatsa letsoai> lihora tse 10,000).

5.2 Liaparo tse Bohlale tse Arabang
Ho kenyelletsa li-microcapsules tse utloang pH:

• Phatlalatso ea Automatic Inhibitor:Benzotriazole-based inhibitors e sebetsa nakong ea kutu, e nang le bokhoni ba ho iphekola> 85%.
• Bophelo ba Tšebeletso bo Atolositsoeng:Lilemo tse 25 (liaparo tse tloaelehileng: lilemo tse 10-15).

Nickel plating endowsfoil ea koporoe nang le "ts'ebetso e ts'oanang le tšepe" ha e ntse e boloka ts'ebetso e ikhethang maemong a feteletseng. Ka ho fihlella ho nepahala ha boemo ba nano le ho fana ka lits'ebetso tse ka khonehang,CIVEN TŠEPEmaemo a nickel-platedfoil ea koporoe le thepa ea motheo bakeng sa tlhahiso e phahameng. Ha lipatlisiso tse ncha tsa matla le sebaka li ntse li tsoela pele,nickel-plated koporo foilntle le pelaelo e tla lula e le thepa ea bohlokoahali ea maano.