Lesela la Koporo le Letlapa la Koporo: Tlhahlobo e Feletseng ho tloha ho Mekhoa ea Tlhahiso ho ea ho Maemo a Kopo

Lefapheng la ts'ebetso ea lintho tse entsoeng ka koporo, "foil ea koporo” le “lesela la koporo” ho batho bao e seng litsebi, phapang pakeng tsa tsena tse peli e ka bonahala e le puo feela, empa tlhahisong ea indasteri, phapang ena e ama ka ho toba khetho ea thepa, litsela tsa tšebetso, le tšebetso ea ho qetela ea sehlahisoa.

1. Tekanyetso ea Botenya: Monahano oa Liindasteri ka morao ho 0.1mm Moeling

Ho latela pono ea botenya,0.1 limilimitharake moeli oa bohlokoa oa ho arola lipakeng tsa likhoele tsa koporo le li-foil tsa koporo. TheKhomishene ya Matjhaba ya Tekenoloji ya Motlakase (IEC)standard e hlalosa ka ho hlaka:

• Leqhoa la Koporo: Lisebelisoa tsa koporo tse sa khaotseng ka botenya≥ 0.1mm
• Foil ea Koporo: Lisebelisoa tsa koporo tse tšesaane haholo tse nang le botenya<0.1mm

Karolelano ena ha se ea boikhethelo empa e ipapisitse le litšobotsi tsa ts'ebetso ea thepa:
Ha botenya bo feta0.1 limilimithara, thepa e finyella ho leka-lekana pakeng tsa ductility le matla a mochine, e leng se etsang hore e tšoanelehe bakeng sa ts'ebetso ea bobeli e kang ho hatakela le ho khumama. Ha botenya bo oela ka tlase0.1 limilimithara, mokhoa oa ho lokisa o tlameha ho fetohela ho otloloha ka nepo, mooboleng ba bokahodimo le botenya bo tshwanangfetoha matšoao a bohlokoa.

Ka tlhahiso ea kajeno ea indasteri, e tloaelehilenglesela la koporothepa ka tloaelo ho fapana pakeng tsa0.15mm le 0.2mm. Ka mohlala, kalibeteri tsa motlakase tsa koloi e ncha (NEV)., 0.18mm lesela la koporo la electrolytice sebedisoa joalo ka thepa e tala. Ka ho fetaLikarolo tse 20 tsa ho tsamaisa ka nepo, qetellong e fetoloa hore e be tšesaane haholofoil ea koporoho tloha ho6μm ho isa ho 12μm, e nang le mamello ea botenya ba±0.5μm.

2. Kalafo ea Bokaholimo: Phapang ea Theknoloji e Tsamaisitsoeng ke Mosebetsi

Kalafo e Tloaelehileng ea Copper Strip:

1. Ho Hloekisa Alkaline - E tlosa mafura a mangata a mafura
2. Chromate Passivation – Mefuta a0.2-0.5μmlera le sireletsang
3. Ho omisa le ho Bopa

Kalafo e Ntlafetseng bakeng sa Foil ea Koporo:

Ntle le ts'ebetso ea koporo ea koporo, foil ea koporo e etsoa:

1. Electrolytic Degreasing - Lisebelisoa3-5A/dm² boima ba hajoaleho50-60°C
2. Nano-Level Surface Roughening – Controls Ra boleng pakeng tsa0.3-0.8μm
3. Kalafo ea Silane ea Anti-Oxidation

Lits'ebetso tsena tse eketsehileng li fana kalitlhoko tse khethehileng tsa ho qetela:
In Boto e hatisitsoeng ea potoloho (PCB) tlhahiso, foil ea koporo e tlameha ho theha atlamo ea boemo ba limolek'hulee nang le li-resin substrates. Leha ho le joalomasala a oli a boemo ba micronka bakamefokolo ea delamination. Lintlha tse tsoang ho moetsi ea ka sehloohong oa PCB li bontša seoelectrolytic degreased koporo foilntlafalaebola matla ka 27%le ho fokotsatahlehelo ea dielectric ka 15%.

3. Maemo a Indasteri: Ho tloha ho Raw Material ho ea ho Lisebelisoa tse sebetsang

Letlapa la koporoe sebetsa joalo ka"mofani oa thepa ea mantlha"ka ketane ea phepelo, e sebelisoang haholo ho:

• Thepa ea Matla: Maqhubu a Transformer (Botenya ba 0.2-0.3mm)
• Lihokelo tsa indasteri: Lipampiri tsa ho khanna tsa terminal (0.15-0.25mm botenya)
• Lisebelisoa tsa Meaho: Ho rulela ka mekhahlelo e thibelang metsi (Botenya ba 0.3-0.5mm)

Ka lehlakoreng le leng, foil ea koporo e fetohile a"masebetsi a sebetsang"e ke keng ea nkeloa sebaka ho:

Ho nkalibeteri tsa motlakasemohlala, foil ea koporo e ikarabella bakeng sa10-15%ea theko ea thepa ea sele. Emong le emongPhokotso ea 1μmbotenya bo eketsehamatla a betri ka 0.5%. Ke ka lebaka leo baetapele ba indasteri ba ratangCATLba sututsa koporo foil botenya ho4 μm.

4. Phetoho ea Theknoloji: Ho Kopanya Meeli le Liphello tsa Ts'ebetso

Ka tsoelo-pele ea saense ea lintho tse bonahalang, moeli oa setso pakeng tsa foil ea koporo le khoele ea koporo o ntse o fetoha butle-butle:

1. Ultra-Thin Copper Strip: 0.08mm lihlahisoa tsa "quasi-foil".li sebelisoa hona joale bakeng satšireletso ea motlakase.
2. Motsoako oa Koporo Foil: 4.5μm koporo + 8μm polima substratee etsa sebopeho sa "sandwich" se robang meeli ea 'mele.
3. Seaparo sa Koporo se sebetsang hantle: Lithapa tsa koporo tse koahetsoeng ka carbon lia bulehameeli e mecha ka har'a peterole cell bipolar plates.

Lintho tsena tse ncha lia hlokahalamaemo a phahameng a tlhahiso. Ho ea ka mohlahisi e moholo oa koporo, ho sebelisatheknoloji ea magnetron sputteringhobane likhoele tse kopantsoeng tsa koporo li fokotsehilekhanyetso ea sebaka sa yuniti ka 40%le ho ntlafatsaho koba bophelo ba mokhathala ka makhetlo a 3.

Qetello: Bohlokoa bo ka Morao ho Lekhalo la Tsebo

Ho utloisisa phapang pakeng tsalesela la koporolefoil ea koporoke taba ea mantlha ea ho utloisisa"quantitative to qualitative"liphetoho tsa boenjiniere ba thepa. Ho tloha ho0.1mm botenya monyakohomekhoa ea phekolo ea boemo ba micronletaolo ea sebopeho sa nanometer-scale, tsoelo-pele e 'ngoe le e 'ngoe ea theknoloji e fetola sebopeho sa indasteri.

Honako ea ho se nke lehlakore ha carbon, tsebo ena e tla susumetsa ka ho tobatlholisano ea k'hamphanilefapheng le lecha la thepa. Etsoe, ka hoindasteri ea betri ea matla,a0.1mm lekhalo la kutloisisoe ka bolela anmoloko oohle oa phapang ea theknoloji.