Foil ea koporoe ntse e e-ba bohlokoa haholo ho pakang li-chip ka lebaka la ho tsamaisa motlakase, ho tsamaisa mocheso, ho sebetsa hantle le ho baballa litšenyehelo. Mona ke tlhahlobo e qaqileng ea lits'ebetso tsa eona tse ikhethileng ho paketeng ea chip:
1. Copper Wire Bonding
- Phetolelo ea Khauta kapa Aluminium Wire: Ka tloaelo, lithapo tsa khauta kapa tsa aluminium li 'nile tsa sebelisoa ho paka li-chip ho hokahanya potoloho ea ka hare ea chip ho isa kantle. Leha ho le joalo, ka tsoelo-pele ea theknoloji ea ts'ebetso ea koporo le ho nahanela litšenyehelo, foil ea koporo le terata ea koporo butle-butle li fetoha likhetho tse tloaelehileng. Motlakase oa koporo oa motlakase o ka bang 85-95% oa khauta, empa litšenyehelo tsa oona ke hoo e ka bang karolo ea leshome, e leng se etsang hore e be khetho e nepahetseng bakeng sa ts'ebetso e phahameng le katleho ea moruo.
- Ntlafatso ea Ts'ebetso ea Motlakase: Khokahano ea terata ea koporo e fana ka khanyetso e tlase le conductivity e ntlafetseng ea mocheso lits'ebetsong tse phahameng tsa maqhubu le tsa morao-rao, ka katleho ho fokotsa tahlehelo ea matla ho li-interconnections tsa chip le ho ntlafatsa ts'ebetso ea motlakase ka kakaretso. Ka hona, ho sebelisa foil ea koporo e le thepa e tsamaisang lits'ebetsong tsa ho kopanya ho ka ntlafatsa ts'ebetso ea ho paka le ho ts'epahala ntle le ho eketsa litšenyehelo.
- E sebelisoa ho li-Electrodes le Micro-Bumps: Ka har'a liphutheloana tsa flip-chip, chip e phunyeletsoa e le hore lisebelisoa tsa ho kenya / lihlahisoa (I / O) holim'a eona li hokahane ka ho toba le potoloho holim'a substrate ea sephutheloana. Foil ea koporo e sebelisoa ho etsa li-electrode le li-micro-bumps, tse rekisoang ka kotloloho ho substrate. Ho hanyetsa mocheso o tlase le conductivity e phahameng ea koporo ho netefatsa hore ho fetisoa ha matšoao le matla ka katleho.
- Tšepahala le Thermal Management: Ka lebaka la ho hanyetsa ha eona hantle ho electromigration le matla a mochine, koporo e fana ka ts'episo e ntle ea nako e telele tlas'a mefuta e sa tšoaneng ea mocheso le likhahla tsa hona joale. Ho feta moo, mocheso o phahameng oa koporo o thusa ho qhala mocheso o hlahisoang nakong ea ts'ebetso ea chip ho substrate kapa sink ea mocheso, ho ntlafatsa bokhoni ba taolo ea mocheso oa sephutheloana.
- Lead Frame Material: Foil ea koporoe sebelisoa haholo ho paka foreimi ea lead, haholo bakeng sa ho paka lisebelisoa tsa matla. Foreimi e etellang pele e fana ka tšehetso ea sebopeho le khokahanyo ea motlakase bakeng sa chip, e hlokang lisebelisoa tse nang le conductivity e phahameng le conductivity e ntle ea mocheso. Foil ea koporo e finyella litlhoko tsena, ka katleho e fokotsa litšenyehelo tsa ho paka ha e ntse e ntlafatsa ho senyeha ha mocheso le ts'ebetso ea motlakase.
- Mekhoa ea Kalafo ea Bokaholimo: Ts'ebelisong e sebetsang, foil ea koporo hangata e etsoa kalafo ea bokaholimo joalo ka nickel, tin, kapa silver plating ho thibela oxidation le ho ntlafatsa ho solderability. Liphekolo tsena li eketsa ho tšoarella le ho ts'epahala ha foil ea koporo ka har'a sephutheloana sa foreimi ea lead.
- Lisebelisoa tsa ho khanna ho Multi-Chip Modules: Theknoloji ea li-system-in-package e kopanya li-chips tse ngata le likarolo tse sa sebetseng ka har'a sephutheloana se le seng ho finyella ho kopanya ho phahameng le ho sebetsa ha matla. Foil ea koporo e sebelisoa ho etsa lipotoloho tse hokelang kahare mme e sebetsa joalo ka tsela ea hajoale ea ho tsamaisa. Sesebelisoa sena se hloka foil ea koporo ho ba le conductivity e phahameng le litšobotsi tse tšesaane haholo ho fihlela ts'ebetso e phahameng sebakeng se lekanyelitsoeng sa ho paka.
- Likopo tsa RF le Millimeter-Wave: Foil ea koporo e boetse e phetha karolo ea bohlokoa ho li-circuits tsa phetiso ea maqhubu a maqhubu a phahameng ho SiP, haholo ho maqhubu a seea-le-moea (RF) le lits'ebetso tsa maqhubu a millimeter. Litšobotsi tsa eona tse tlase tsa tahlehelo le conductivity e babatsehang li e lumella ho fokotsa ho fokotsa matšoao ka katleho le ho ntlafatsa katleho ea phetisetso lits'ebetsong tsena tse phahameng tsa maqhubu.
- E sebelisoa ho Redistribution Layers (RDL): Ka har'a liphutheloana tsa fan-out, foil ea koporo e sebelisetsoa ho haha mohato oa ho arola bocha, theknoloji e khutlisetsang chip I / O sebakeng se seholoanyane. The conductivity e phahameng le ho khomarela hantle ha foil ea koporo e etsa hore e be thepa e loketseng bakeng sa ho haha mekhahlelo ea ho arola bocha, ho eketsa sekhahla sa I / O le ho tšehetsa ho kopanya li-chip tse ngata.
- Phokotso ea Boholo le Botšepehi ba Letšoao: Tšebeliso ea foil ea koporo likarolong tsa kabo e ncha e thusa ho fokotsa boholo ba sephutheloana ha e ntse e ntlafatsa botšepehi le lebelo la phetisetso ea matšoao, e leng ea bohlokoa ka ho khetheha ho lisebelisoa tsa mohala le lisebelisoa tsa k'homphieutha tse sebetsang hantle tse hlokang boholo bo fokolang ba liphutheloana le ts'ebetso e phahameng.
- Litanka tsa Mocheso oa Copper Foil le Thermal Channels: Ka lebaka la ts'ebetso ea eona e ntle ea mocheso, foil ea koporo e atisa ho sebelisoa litšeng tsa mocheso, mechine ea mocheso, le lisebelisoa tsa mocheso oa mocheso ka har'a liphutheloana tsa chip ho thusa ka potlako ho fetisetsa mocheso o hlahisoang ke chip ho ea mehahong e pholileng e ka ntle. Sesebelisoa sena se bohlokoa haholo ho li-chips tsa matla a phahameng le liphutheloana tse hlokang taolo e nepahetseng ea mocheso, joalo ka li-CPU, li-GPU, le li-chips tsa taolo ea matla.
- E sebelisoa ka Technology-Silicon Via (TSV) Technology: Ka theknoloji ea ho paka tsa 2.5D le 3D chip, foil ea koporo e sebelisoa ho theha thepa e tlatsoang ea li-silicone, e fana ka khokahano e otlolohileng lipakeng tsa lichifi. Ts'ebetso e phahameng le ts'ebetso ea foil ea koporo e etsa hore e be ntho e ratoang haholo litheknolojing tsena tse tsoetseng pele tsa ho paka, tse ts'ehetsang khokahano e phahameng ea methapo le litselana tse khuts'oane tsa lipontšo, ka hona ho matlafatsa ts'ebetso ea sistimi ka kakaretso.
2. Sephutheloana sa Flip-Chip
3. Moeta-pele oa Frame Packaging
4. Sisteme-in-Package (SiP)
5. Fan-Out Packaging
6. Tsamaiso ea Mocheso le Likopo tsa ho Fetola Mocheso
7. Mahlale a Advanced Packaging (joalo ka 2.5D le 3D Packaging)
Ka kakaretso, ts'ebeliso ea foil ea koporo ka har'a sephutheloana sa chip ha e felle feela likhokahanong tsa setso le taolo ea mocheso empa e fetela ho mahlale a ntseng a hlaha a ho paka a kang flip-chip, system-in-package, fan-out packaging le 3D packaging. Lintho tse nang le mesebetsi e mengata le ts'ebetso e babatsehang ea foil ea koporo li phetha karolo ea bohlokoa ho ntlafatseng ho tšepahala, ho sebetsa le ho boloka litšenyehelo tsa ho paka li-chip.
Nako ea poso: Sep-20-2024