Foil ea koporo

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• : Ka setso, khauta ea khauta kapa ea aluminium e sebelisitsoe ho PUP ho kenella ka matla ho li-applically conction ea chip e ka hare ho ea ka hare ea chip ho ea ka hare ea chip. Leha ho le joalo, ka tsoelo-pele ea ho sebetsa ka theknoloji ea koporong le ho nahana ka theko, terata ea koporo le raperper e sebetsa butle butle. Moetlo oa Compper oa koporo o ka ba 85-95% ea khauta, empa litšenyehelo tsa eona li ka le khetho e ntle bakeng sa ts'ebetso e phahameng le katleho ea moruo.
• : Terata ea koporo e fana ka khanyetso e tlase le e ntle likopo tse futhumetseng tsa nako le nako, ho fokotsa ts'ebetso ea matla le ho ntlafatsa ts'ebetso ea motlakase le ho ntlafatsa ts'ebetso ea motlakase le ho ntlafatsa ts'ebetso ea motlakase. Thus, using copper foil as a conductive material in bonding processes can enhance packaging efficiency and reliability without increasing costs.
• : Ka lebaka la khanyetso ea eona e ntle ea ho lelekoa ho elella le matla a mochini, koporo e fana ka bonnete ba nako e telele ea ho tšepahala le matsoalloa hona joale. Ho feta moo, ho etsoa ha copper e phahameng e thusang ka potlako nakong ea ts'ebetso ea Chip ts'ebetso kapa mocheso oa mocheso.
• : Foil ea koporo
• Likopo tse sebetsang, foiri ea koporo hangata e feta kalafong ea holimo e kang nickel, tin, kapa ho beha likepe tsa silevera ho thibela oxidation le ho ntlafatsa letso. These treatments further enhance the durability and reliability of copper foil in lead frame packaging.
• : Moruti oa Copper hape o bapala karolo ea bohlokoa ea litoropo tse lulang khafetsa ka har'a sip, haholo-holo likopo tse peli tsa wave. Litšobotsi tsa ho felloa ke litšobotsi tse tlase le boitšoaro bo botle li le lumella ho fokotsa ho lumellanya ho sebetsa ka mokhoa o atlehileng le ho ntlafatsa ts'ebetso ea ho fetisetsa lits'ebeletso khafetsa.
• : In fan-out packaging, copper foil is used to construct the redistribution layer, a technology that redistributes chip I/O to a larger area. Ho ikamahanya le maemo le ho khomarela ho hoholo ha coil foil foil e etsa hore e be lintho tse loketseng ho haha ​​likarolo tsa thetsitso, ho eketsa maikutlo le ho ts'ehetsa ho kopana ha likarolo tse ngata.
• : Ho sebelisoa ha foil ea Copper Bofelong ba ho khutlisa taolo ho thusa ho tlosa sephutheloana le lits'ebetsong tse ngata tsa mehala e hlokang likarolo tse nyane le ts'ebetso e phahameng.
• : Ka lebaka la pherekano ea eona e phahameng ea motlakase, hangata foil e sebelisoa ka har'a siling ea mocheso, lisebelisoa tsa liqhomane tse tsoang kahare ho toropo ho thusa meralo ea kantle. Kopo ena e bohlokoa haholo lichineng le liphutheloana tse nang le matla le liphutheloana tse hlokang taolo e nepahetseng, joalo ka li-cpu tse kholo, li-gpus tsa tsamaiso ea matla.
• : Ka mahlakore a boloi a 2D le 3D Ho ba le boitšoaro bo phahameng le bohato ba koporo ea koporo ho etsa boitsebiso bo khethiloeng mahlaleng ana ba liphuthehong tse phahameng tsa liphutheloana, ka ho etsa joalo, ho ntlafatsa ts'ebetso ea tsamaiso ka kakaretso.

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Ka kakaretso, ts'ebeliso ea foil ea Copper ho Phuthelo ea Chip ha e felle feela khokahano ea setso le taolo, ho boloka tsamaiso ka sephutheloana le ho paka. Melemo ea li -fiftuni e le tumellano le ts'ebetso e ntle ea Copper ea koporo e bapala karolo ea bohlokoa ho ntlafatsa ts'episo, ts'ebetso le litšenyehelo tse theko e tlaase.